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Solid-state reactions and stress evolutions between SnAg and Ni(P) thin films

Published online by Cambridge University Press:  31 January 2011

Jae Yong Song  and
Jin Yu
Jae Yong Song*
Affiliation:
Division of Advanced Technology, Korea Research Institute of Standards and Science, Yuseong-gu, Daejeon 305-340, Korea
Jin Yu
Affiliation:
Center for Electronic Packaging Materials, Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Yuseong-gu, Daejeon 305-701, Korea
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

Phase transformations in SnAg–Ni80P20 films were studied ex situ in parallel with in situ measurements of the corresponding transformation-induced stresses. Layered formation of Ni3Sn4 and Ni3P phases at an early stage of a reaction between SnAg and Ni80P20 films resulted in a tensile stress similar to the stress evolution in Sn–Ni80P20 films, despite the additional formation of Ag3Sn phase. Ag3Sn phase did not significantly affect the degree of stress evolution because of its islandlike and sporadic formation on the top surface of the Ni3Sn4 layer. Isothermal annealing showed that compressive stress, which was induced by the dominant formation of Ni3Sn4, developed after an initial evolution of tensile stress.

Keywords

Phase transformationStress/strain relationshipThin film
Type
Articles
Information
Journal of Materials Research , Volume 24 , Issue 2 , February 2009 , pp. 482 - 486
Copyright
Copyright © Materials Research Society 2009

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References

REFERENCES

1.Islam, M.N., Sherif, A., Chan, Y.C.: Effect of volume in interfacial reaction between eutectic Sn–3.5%Ag–0.5%Cu solder and Cu metallization in microelectronic packaging. J. Electron. Mater. 34, 143 (2005)CrossRefGoogle Scholar
2.Alam, M.O., Chan, Y.C., Hung, K.C.: Interfacial reaction of Pb–Sn solder and Sn–Ag solder with electroless Ni deposit during reflow. J. Electron. Mater. 31, 1117 (2002)CrossRefGoogle Scholar
3.Chen, Z., He, M., Qi, G.: Morphology and kinetic study of the interfacial reaction between the Sn–3.5Ag solder and electroless Ni–P metallization. J. Electron. Mater. 33, 1465 (2004)CrossRefGoogle Scholar
4.Chen, W.T., Ho, C.E., Kao, C.R.: Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders. J. Mater. Res. 17, 263 (2002)CrossRefGoogle Scholar
5.Lee, T.Y., Choi, W.J., Tu, K.N., Jang, J.W., Kuo, S.M., Lin, J.K., Frear, D.R., Zeng, K., Kivilahti, J.K.: Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu. J. Mater. Res. 17, 291 (2002)CrossRefGoogle Scholar
6.Kim, J.Y., Sohn, Y.C., Yu, J.: Effect of Cu content on the mechanical reliability of Ni/Sn–3.5Ag system. J. Mater. Res. 22, 770 (2007)CrossRefGoogle Scholar
7.Jang, J.W., Kim, P.G., Tu, K.N., Frear, D.R., Thompson, P.: Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology. J. Appl. Phys. 85, 8456 (1999)CrossRefGoogle Scholar
8.Sohn, Y.C., Yu, J., Kang, S.K., Choi, W.K., Shih, D.Y.: Study of reaction mechanism between electroless Ni–P and Sn and its effect on the crystallization of Ni–P. J. Mater. Res. 18, 4 (2003)CrossRefGoogle Scholar
9.Lee, C-Y., Lin, K-L.: The interaction kinetics and compound formation between electroless Ni–P and solder. Thin Solid Films 249, 201 (1994)CrossRefGoogle Scholar
10.Chan, Y.C., Tu, P.L., Tang, C.W., Hung, K.C., Lai, J.K.L.: Reliability studies μBGA solder joints-effect of Ni–Sn intermetallic compound. IEEE Trans. Adv. Packag. 24, 25 (2001)CrossRefGoogle Scholar
11.Mitchell, D., Guo, Y., Sarihan, V.: Methodology for studying the impact of intrinsic stress on the reliability of the electroless Ni UBM structure. IEEE Trans. Compon. Packag. Technol. 24, 667 (2001)CrossRefGoogle Scholar
12.Kang, S.K., Rai, R.S., Purushothaman, S.: Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders. J. Electron. Mater. 25, 1113 (1996)CrossRefGoogle Scholar
13.Bader, S., Gust, W., Hieber, H.: Rapid formation of intermetallic compounds by interdiffusion in the Cu–Sn and Ni–Sn systems. Acta Metall. Mater. 43, 329 (1995)Google Scholar
14.Gur, D., Bamberger, M.: Reactive isothermal solidification in the Ni–Sn system. Acta Mater. 46, 4917 (1998)CrossRefGoogle Scholar
15.Song, J.Y., Yu, J.: Residual stress measurements in electroless plated Ni–P films. Thin Solid Films 415, 167 (2002)CrossRefGoogle Scholar
16.Song, J.Y., Yu, J.: Effect of phosphorous content on phase transformation induced stress in Sn/Ni(P) thin films. J. Mater. Res. 21, 2261 (2006)CrossRefGoogle Scholar
17.Song, J.Y.: Layered intermetallic compounds and stress evolution in Sn and Ni(P) films. J. Mater. Res. 22, 2025 (2007)CrossRefGoogle Scholar
18.Stoney, G.G.: The tension of metallic films deposited by electrolysis. Proc. R. Soc. London, Ser. A 82, 172 (1909)Google Scholar
19.Song, J.Y., Yu, J., Lee, T.Y.: Analysis of phase transformation kinetics by intrinsic stress evolutions during the isothermal aging of amorphous Ni(P) and Sn/Ni(P) films. J. Mater. Res. 19, 1257 (2004)CrossRefGoogle Scholar