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SiC-bonded diamond materials produced by pressureless silicon infiltration

Published online by Cambridge University Press:  19 June 2017

Björn Matthey*
Affiliation:
Fraunhofer IKTS, Fraunhofer Institute for Ceramic Technologies and Systems, Dresden 01277, Germany
Steffen Kunze
Affiliation:
Fraunhofer IKTS, Fraunhofer Institute for Ceramic Technologies and Systems, Dresden 01277, Germany
Martin Hörner
Affiliation:
Fraunhofer IWM, Fraunhofer Institute for Mechanics of Materials, Freiburg im Breisgau 79108, Germany
Bernhard Blug
Affiliation:
Fraunhofer IWM, Fraunhofer Institute for Mechanics of Materials, Freiburg im Breisgau 79108, Germany
Maike van Geldern
Affiliation:
KSB Aktiengesellschaft, Pegnitz 91257, Germany
Alexander Michaelis
Affiliation:
Fraunhofer IKTS, Fraunhofer Institute for Ceramic Technologies and Systems, Dresden 01277, Germany
Mathias Herrmann
Affiliation:
Fraunhofer IKTS, Fraunhofer Institute for Ceramic Technologies and Systems, Dresden 01277, Germany
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

Extremely hard, wear-resistant SiC-bonded diamond materials with diamond contents of approximately 45–60% by volume can be prepared by pressureless infiltration of shaped diamond compacts with silicon. Materials with diamond grain sizes in the range of 10–100 µm can be produced having a free silicon content of less than 5 vol%. Components with large dimensions can be prepared as graded or ungraded materials. Graded components are composed of silicon infiltrated SiC base material with diamond–SiC composite layers of 0.1 mm by dip coating technology to several mm in thickness by doubled die pressing in regions with high loading. This creates the possibility of producing low-cost, wear-resistant components of various geometries and dimensions with bending strengths of 400–500 MPa, hardness values of 48 GPa, and fracture toughness levels of 4.5–5 MPa m1/2 for use in extreme wear conditions. Thermal conductivities of up to 500 W/(m K) were obtained, render these materials interesting for heat sinks.

Type
Invited Articles
Copyright
Copyright © Materials Research Society 2017 

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Footnotes

Contributing Editor: Nahum Travitzky

References

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