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Sedimentation of Cu-rich intermetallics in liquid lead-free solders

Published online by Cambridge University Press:  31 January 2011

Jenn-Ming Song ,
Yu-Lin Shen  and
Hsin-Yi Chuang
Jenn-Ming Song*
Affiliation:
Department of Materials Science and Engineering, National Dong Hwa University, Hualien 974, Taiwan
Yu-Lin Shen
Affiliation:
Department of Materials Science and Engineering, National Dong Hwa University, Hualien 974, Taiwan
Hsin-Yi Chuang
Affiliation:
Department of Materials Science and Engineering, National Dong Hwa University, Hualien 974, Taiwan
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

This study investigated the behavior of Cu-containing intermetallic compounds (IMCs) in liquid Sn–Ag and Sn–Zn solders. Experimental results show that for the intermetallics investigated, Cu–Sn and Cu–Zn compounds, the occurrence of settling was dominated by the crystalline temperature of IMCs, buoyancy due to difference in densities, and dissolution potential for the compounds into the liquid. The complete dissolution of Cu–Zn compounds, which took place in the Sn–Zn solders when the Cu content exceeded a critical value, might be ascribed to the depletion of Zn in the melt.

Keywords

AlloySolderingCompound
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 12 , December 2007 , pp. 3432 - 3439
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1Bader, W.G.: Dissolution of Au, Ag, Pd, Pt, Cu and Ni in a molten tin–lead solder. Welding J. 48, 551s 1969Google Scholar
2Yeh, P.Y., Song, J.M.Lin, K.L.: Dissolution behavior of Cu and Ag substrates in molten solders. J. Electron. Mater. 35, 978 2006Google Scholar
3Kim, K.S., Huh, S.H.Suganuma, K.: Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu. Microelectron. Reliab. 43, 259 2003Google Scholar
4Song, J.M., Lui, T.S., Lan, G.F.Chen, L.H.: Microstructure and tensile properties of Sn–Zn–Ag lead free solder alloys. Scripta Mater. 48, 1047 2003CrossRefGoogle Scholar
5Kang, S.S.Sarkhel, A.K.: Lead free solders for electronic packaging. J. Electron. Mater. 23, 701 1994Google Scholar
6Bradley, E.Hranisavljevic, J.: Characterization of the melting and wetting of Sn–Ag–X solders. IEEE Trans. Electron. Packag. Manuf. 24, 255 2001Google Scholar
7Shohji, I., Yoshida, T., Takahashi, T.Hioki, S.: Tensile properties of Sn–3.5Ag and Sn–3.5Ag–0.75Cu lead-free solders. Mater. Trans. 43, 1854 2002CrossRefGoogle Scholar
8Yu, D.Q., Xie, H.P.Wang, L.: Investigation of interfacial microstructure and wetting property of newly developed Sn–Zn–Cu solders with Cu substrate. J. Alloys Compd. 385, 119 2004Google Scholar
9 JCPDS No. 25-1228. International Center for Diffraction Data, Newton Square, PAGoogle Scholar
10 JCPDS No. 45-1488. International Center for Diffraction Data: Newton Square, PAGoogle Scholar
11Loomans, M.E.Fine, M.E.: Tin–silver–copper eutectic temperature and composition. Metall. Mater. Trans. A 31, 1155 2000CrossRefGoogle Scholar
12Moon, K.W., Boettinger, W.J., Kattner, U.R., Biancaniello, F.S.Handwerker, C.A.: Experimental and thermodynamic assessment of Sn–Ag–Cu solder alloys. J. Electron. Mater. 29, 1122 2000CrossRefGoogle Scholar
13Ohnuma, I., Miyashita, M., Liu, X.J., Ohtani, H.Ishida, K.: Phase equilibria and thermodynamic properties of Sn–Ag based Pb-free solder alloys. IEEE Trans. Electron. Packag. Manuf. 26, 84 2003Google Scholar
14Yoon, J.W., Kim, S.W.Jung, S.B.: IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic NiBGA substrate. J. Alloys Compd. 392, 247 2005Google Scholar
15Chen, C.J.Lin, K.L.: The reactions between electroless Ni–Cu–P deposit and 63Sn-37Pb flip chip solder bumps during reflow. J. Electron. Mater. 29, 1007 2000Google Scholar
16Lee, B.J., Hwang, N.M.Lee, H.M.: Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation. Acta Mater. 45, 1867 1997Google Scholar
17Massalski, T.B.Binary Alloy Phase Diagrams 2nd ed.American Society for Metals Materials Park, OH 1990 1508Google Scholar
18Huang, C.W.Lin, K.L.: Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C. J. Mater. Res. 19, 3560 2004CrossRefGoogle Scholar
19Chou, C.Y.Chen, S.W.: Phase equilibria of the Sn–Zn–Cu ternary system. Acta Mater. 54, 2393 2006Google Scholar
20Dybkov, V.I.: Interaction of iron–nickel alloys with liquid aluminum, part 1 dissolution kinetics. J. Mater. Sci. 28, 6371 1993CrossRefGoogle Scholar
21Ma, D., Wang, W.D.Lahiri, S.K.: Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow. J. Appl. Phys. 91, 3312 2003Google Scholar