Hostname: page-component-586b7cd67f-tf8b9 Total loading time: 0 Render date: 2024-11-26T09:21:30.727Z Has data issue: false hasContentIssue false

Role of stacking fault energy and strain rate in strengthening of Cu and Cu–Al alloys

Published online by Cambridge University Press:  20 August 2014

Baozhuang Cai
Affiliation:
Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650000, China
Yan Long
Affiliation:
Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650000, China
Cuie Wen
Affiliation:
Faculty of Engineering and Industrial Sciences, Swinburne University of Technology, Hawthorn, Victoria 3122, Australia
Yulan Gong
Affiliation:
Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650000, China
Caiju Li
Affiliation:
Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650000, China
Jingmei Tao
Affiliation:
Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650000, China
Xinkun Zhu*
Affiliation:
Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650000, China
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

Cu and Cu–Al alloys with different stacking fault energies (SFEs) were processed using rolling and the Split Hopkinson pressure bar followed by rolling. The effect of strain rate on the microstructures and mechanical properties of the alloys were investigated using x-ray diffraction analyses, transmission electron microscopy, and tensile tests. Tensile testing results demonstrated that the strength and ductility of the samples increased simultaneously with decreasing SFE. Microstructural observations indicated that the average grain size of the samples decreased with decreasing SFE, but the twin and dislocation densities increased. With decreasing SFE, twinning becomes the dominant deformation mechanism. Our findings indicated that the SFEs significantly affect the strength and ductility of the materials because they play a key role in determining the deformation mechanism. Decreasing the SFE of Cu alloys has proved to be the optimum method to improve the ductility without compromising the strength of the material.

Type
Articles
Copyright
Copyright © Materials Research Society 2014 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Li, H., Zhou, J.Q., Zhu, R.T., and Ling, X.: The evolution of porosity in bulk nanocrystalline materials during plastic deformation and its effect on the mechanical behavior. Mater. Des. 31, 1003 (2010).CrossRefGoogle Scholar
Valiev, R.Z. and Langdon, T.G.: Principles of equal-channel angular pressing as a processing tool for grain refinement. Prog. Mater. Sci. 51, 881 (2006).Google Scholar
Koch, C.C.: Synthesis of nanostructured materials by mechanical milling: Problems and opportunities. Nanostruct. Mater. 9, 13 (1997).Google Scholar
Saito, Y., Utsunomiya, H., Tsuji, N., and Sakai, T.: Novel ultra-high straining process for bulk materials—development of the accumulative roll-bonding (ARB) process. Acta Mater. 47, 579 (1999).CrossRefGoogle Scholar
Zhilyaev, A.P. and Langdon, T.G.: Using high-pressure torsion for metal processing: Fundamentals and applications. Prog. Mater. Sci. 53, 893 (2008).Google Scholar
Tian, Y.Z., An, X.H., Wu, S.D., Zhang, Z.F., Figueiredo, R.B., Gao, N., and Langdon, T.G.: Direct observations of microstructural evolution in a two-phase Cu–Ag alloy processed by high-pressure torsion. Scr. Mater. 63, 65 (2010).CrossRefGoogle Scholar
Tian, Y.Z., Han, W.Z., Yang, H.J., Li, S.X., Wu, S.D., and Zhang, Z.F.: Shear banding observations in Cu–16 wt% Ag alloy subjected to one-pass equal channel angular pressing. Scr. Mater. 62, 183 (2010).Google Scholar
Zhang, Z.F., Wu, S.D., Li, Y.J., Liu, S.M., and Wang, Z.G.: Cyclic deformation and fatigue properties of Al–0.7 wt% Cu alloy produced by equal channel angular pressing. Mater. Sci. Eng., A 412, 279 (2005).CrossRefGoogle Scholar
Huang, C.X., Wang, K., Wu, S.D., Zhang, Z.F., Li, G.Y., and Li, S.X.: Deformation twinning in polycrystalline copper at room temperature and low strain rate. Acta Mater. 54, 655 (2006).Google Scholar
Han, K., Walsh, R.P., Ishmaku, A., Toplosky, V., Brandao, L., and Embury, J.D.: High strength and high electrical conductivity bulk Cu. Philos. Mag. 84, 3705 (2004).Google Scholar
Hughes, D.A. and Hansen, N.: Microstructure and strength of nickel at large strains. Acta Mater. 48, 2985 (2000).Google Scholar
Torre, F.D., Lapovok, R., Sandlin, J., Thomson, P.F., and Davies, C.H.J.: Microstructures and properties of copper processed by equal channel angular extrusion for 1–16 passes. Acta Mater. 52, 4819 (2004).CrossRefGoogle Scholar
Mishin, O.V. and Gottstein, G.: Microstructural aspects of rolling deformation in ultrafine-grained copper. Philos. Mag. A 78, 373 (1998).CrossRefGoogle Scholar
Koch, C.C.: Optimization of strength and ductility in nanocrystalline and ultrafine grained metals. Scr. Mater. 49, 657 (2003).CrossRefGoogle Scholar
Zhao, Y.H., Liao, X.Z., Horita, Z., Langdon, T.G., and Zhu, Y.T.: Determining the optimal stacking fault energy for achieving high ductility in ultrafine-grained Cu–Zn alloys. Mater. Sci. Eng., A 493, 123 (2008).Google Scholar
An, X.H., Han, W.Z., Huang, C.X., Zhang, P., Yang, G., Wu, S.D., and Zhang, Z.F.: High strength and utilizable ductility of bulk ultrafine-grained Cu–Al alloys. Appl. Phys. Lett. 92, 201915 (2008).CrossRefGoogle Scholar
Bahmanpour, H., Kauffmann, A., Khoshkhoo, M.S., Youssef, K.M., Mula, S., Freudenberger, J., Eckert, J., Scattergood, R.O., and Koch, C.C.: Effect of stacking fault energy on deformation behavior of cryo-rolled copper and copper alloys. Mater. Sci. Eng., A 529, 230 (2011).CrossRefGoogle Scholar
Li, Y.S., Zhang, Y., Tao, N.R., and Lu, K.: Effect of the Zener–Hollomon parameter on the microstructures and mechanical properties of Cu subjected to plastic deformation. Acta Mater. 57, 761 (2009).Google Scholar
Huang, F. and Tao, N.R.: Effects of strain rate and deformation temperature on microstructures and hardness in plastically deformed pure aluminum. J. Mater. Sci. Technol. 27, 1 (2011).CrossRefGoogle Scholar
Koch, C.C., Morris, D.G., Lu, K., and Inoue, A.: Ductility of nanostructured materials. Mater. Res. Soc. Bull. 24, 54 (1999).Google Scholar
Murr, L.E.: Interfacial Phenomena in Metals and Alloys (Addison-Wesley Publishing Co., New York, NY, 1975), pp. 87164.Google Scholar
Murty, B.S., Venugopal, T., and Rao, K.P.: Mechanical and electrical properties of Cu-Ta nanocomposites prepared by high-energy ball milling. Acta Metall. 55, 4439 (2007).Google Scholar
Smallman, R.E. and Westmacott, K.H.: Stacking faults in face-centred cubic metals and alloys. Philos. Mag. 2, 669 (1957).Google Scholar
Williamson, G.K. and Smallman, R.E.: Dislocation densities in some annealed and cold-worked metals from measurements on the x-ray Debye-Scherrer spectrum. Philos. Mag. 1, 34 (1956).CrossRefGoogle Scholar
Cohen, J.B. and Wagner, C.N.J.: Determination of twin fault probabilities from the diffraction patterns of fcc metals and alloys. J. Appl. Phys. 33, 2073 (1962).Google Scholar
Wagner, C.N.J.: Stacking faults by low-temperature cold work in copper and alpha brass. Acta Metall. 5, 427 (1957).Google Scholar
Hansen, N.: Hall–Petch relation and boundary strengthening. Scr. Mater. 51, 801 (2004).CrossRefGoogle Scholar
Huang, X.X.: Tailoring dislocation structures and mechanical properties of nanostructured metals produced by plastic deformation. Scr. Mater. 60, 1078 (2009).Google Scholar
Labusch, R.: A statistical theory of solid solution hardening. Phys. Status Solidi 41, 659 (1970).CrossRefGoogle Scholar
Vöhringer, O.: The influence of alloy type and concentration on the yield point of alpha-copper alloys. Z. Metallkde. 65, 352 (1974).Google Scholar
Fleischer, R.L.: Substitutional solution hardening. Acta Metall. 11, 203 (1963).CrossRefGoogle Scholar
Nagarjuna, S., Srinivas, M., and Sharma, K.K.: The grain size dependence of flow stress in a Cu–26Ni–17Zn alloy. Acta Mater. 48, 1807 (2000).CrossRefGoogle Scholar
Hall, E.O.: The deformation and ageing of mild steel: III Discussion of results. Proc. Phys. Soc. B 64, 747 (1951).Google Scholar
Petch, N.J.: The cleavage strength of poly-crystals. J. Iron Steel Inst., London 174, 25 (1953).Google Scholar
Lu, K., Lu, L., and Suresh, S.: Strengthening materials by engineering coherent internal boundaries at the nanoscale. Science 324, 349 (2009).CrossRefGoogle ScholarPubMed
Shen, Y.F., Lu, L., Lu, Q.H., Jin, Z.H., and Lu, K.: Tensile properties of copper with nano-scale twins. Scr. Mater. 52, 989 (2005).CrossRefGoogle Scholar
Babyak, W.J. and Rhines, F.N.: The relationship between the boundary area and hardness of recrystallized cartridge brass. Trans. Metall. Soc. AIME 218, 21 (1960).Google Scholar
Zhang, Y., Tao, N.R., and Lu, K.: Effects of stacking fault energy, strain rate and temperature on microstructure and strength of nanostructured Cu–Al alloys subjected to plastic deformation. Acta Mater. 59, 6048 (2011).Google Scholar
Shen, T.D. and Koch, C.C.: Formation, solid solution hardening and softening of nanocrystalline solid solutions prepared by mechanical attrition. Acta Mater. 44, 753 (1996).Google Scholar
Zhao, Y.H., Horita, Z., Langdon, T.G., and Zhu, Y.T.: Evolution of defect structures during cold rolling of ultrafine-grained Cu and Cu–Zn alloys: Influence of stacking fault energy. Mater. Sci. Eng., A 474, 342 (2008).Google Scholar
Gubicza, J., Chinh, N.Q., Lábár, J.L., Hegedus, Z., and Langdon, T.G.: Principles of self-annealing in silver processed by equal-channel angular pressing: The significance of a very low stacking fault energy. Mater. Sci. Eng., A 527, 752 (2010).Google Scholar
Lu, L., Shen, Y., Chen, X., Qian, L., and Lu, K.: Ultrahigh strength and high electrical conductivity in copper. Science 304, 422 (2004).CrossRefGoogle ScholarPubMed
Zhao, Y.H., Bingert, J.F., Liao, X.Z., Cui, B.Z., Han, K., VSergueeva, A., Mukherjee, A.K., Valiev, R.Z., Langdon, T.G., and Zhu, Y.T.: Simultaneously increasing the ductility and strength of ultra‐fine‐grained pure copper. Adv. Mater. 18, 2949 (2006).Google Scholar
Christian, J.W. and Mahajan, S.: Deformation twinning. Prog. Mater. Sci. 39, 1 (1995).Google Scholar
Rohatgi, A., Vecchio, K.S., and Gray, G.T. III: A metallographic and quantitative analysis of the influence of stacking fault energy on shock-hardening in Cu and Cu–Al alloys. Acta Mater. 49, 427 (2001).Google Scholar
Zener, C. and Hollomon, J.H.: Effect of strain rate upon plastic flow of steel. J. Appl. Phys. 15, 22 (1944).Google Scholar
Xiao, G.H., Tao, N.R., and Lu, K.: Effects of strain, strain rate and temperature on deformation twinning in a Cu–Zn alloy. Scr. Mater. 59, 975 (2008).Google Scholar
Li, Y.S., Zhang, Y., Tao, N.R., and Lu, K.: Effect of thermal annealing on mechanical properties of a nanostructured copper prepared by means of dynamic plastic deformation. Scr. Mater. 59, 475 (2008).Google Scholar
Kocks, U.F., Argon, A.S., and Ashby, M.F.: Thermodynamics and kinetics of slip. Prog. Mater. Sci. 19, 26 (1975).Google Scholar
Wang, K., Tao, N.R., Liu, G., Lu, J., and Lu, K.: Plastic strain-induced grain refinement at the nanometer scale in copper. Acta Mater. 54, 5281 (2006).Google Scholar
Hansen, N.: Cold deformation microstructures. Mater. Sci. Technol. 6, 1039 (1990).Google Scholar