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Residual stress measurements of thin aluminum metallizations by continuous indentation and x-ray stress measurement techniques

Published online by Cambridge University Press:  31 January 2011

W.R. LaFontaine ,
C.A. Paszkiet ,
M.A. Korhonen  and
Che-Yu Li
W.R. LaFontaine
Affiliation:
IBM Corporation, 1701 North Street, Endicott, New York 13760
C.A. Paszkiet
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca, New York 14853
M.A. Korhonen
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca, New York 14853
Che-Yu Li
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca, New York 14853
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Abstract

Stress relaxation in aluminum films of several thicknesses was characterized by using both continuous indentation and x-ray diffraction techniques. Results of the indentation and x-ray stress measurements compare closely for films of small thicknesses. Indentation data from thicker films do not compare well to the x-ray data due to the presence of a residual stress distribution.

Type
Articles
Information
Journal of Materials Research , Volume 6 , Issue 10 , October 1991 , pp. 2084 - 2090
Copyright
Copyright © Materials Research Society 1991

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