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Relationships between the thermal stability, friction, and wear properties of reactively sputtered Si–aC:H thin films

Published online by Cambridge University Press:  31 January 2011

Ryan D. Evans ,
Gary L. Doll  and
Jeffrey T. Glass
Ryan D. Evans
Affiliation:
Advanced Materials R&D, The Timken Company, Canton, Ohio 44706
Gary L. Doll
Affiliation:
Advanced Materials R&D, The Timken Company, Canton, Ohio 44706
Jeffrey T. Glass
Affiliation:
Department of Chemical Engineering, Case Western Reserve University, Cleveland, Ohio 44106
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Abstract

The friction and wear performance were correlated with the thermal stability of reactively sputtered Si–aC:H thin films containing various Si and H concentrations. The average steady-state friction coefficients as measured by dry sliding pin-on-disk tests decreased with increasing Si and H content. Furthermore, the films with high Si and H formed thick transfer films as compared to the films with little or no Si and H content. Minimums in average ball abrasion rate and average film wear rate were observed at the Si/C = 0.10 film composition. The most intense and distinct “graphitic” Raman peaks were collected from the Si/C = 0.10 transfer film debris. In addition, the Si/C = 0.10 film also had the most distinguishable graphitic Raman signature after annealing in air at 500 °C compared to the other Si–aC:H films, suggesting a possible relationship between the nature of transfer films resulting from dry sliding in air and the bulk films that were annealed in air.

Type
Articles
Information
Journal of Materials Research , Volume 17 , Issue 11 , November 2002 , pp. 2888 - 2896
Copyright
Copyright © Materials Research Society 2002

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