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Quantitative evaluation of adhesion of diamond coatings

Published online by Cambridge University Press:  31 January 2011

Qi Hua Fan ,
A. Fernandes ,
E. Pereira  and
J. Grácio
Qi Hua Fan
Affiliation:
Department of Physics, University of Aveiro, 3810 Aveiro, Portugal
A. Fernandes
Affiliation:
Department of Physics, University of Aveiro, 3810 Aveiro, Portugal
E. Pereira
Affiliation:
Department of Physics, University of Aveiro, 3810 Aveiro, Portugal
J. Grácio
Affiliation:
Department of Mechanical Engineering, University of Aveiro, 3810 Aveiro, Portugal
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Abstract

This paper presents a model to evaluate quantitatively the adhesion of diamond coating according to indentation tests. It is found that small indentation load causes round spallation of the coating, no matter what the shape of the indenter. An exponential sink-in deformation of the coating under the indentation is proposed [y = −a × exp(−bx)]. The deformation stress at the spallation edge is considered the coating adhesion. Using an experimentally observed relation of the indentation load versus the film spallation radius, we evaluate the adhesion of a diamond coating on copper to be about 1.921–1.956 GPa, which is in agreement with thermal quench results. The validity of this model is also verified by its self-consistence.

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 3 , March 1999 , pp. 1142 - 1147
Copyright
Copyright © Materials Research Society 1999

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References

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