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The physical interpretation of the activation energy for hot deformation of Ni and Ni–30Cu alloys

Published online by Cambridge University Press:  17 March 2016

Amir Momeni
Amir Momeni*
Affiliation:
Materials Science and Engineering Department, Hamedan University of Technology, Hamedan 6516913733, Iran
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Hot compression tests on pure Ni and Ni–30Cu at 950–1150 °C and strain rates of 0.001–1 s−1 were performed to identify the physical interpretation of the apparent activation energy (Qd). For pure Ni, Qd was constant and identical to that of the self-diffusion. However, for Ni–30Cu, it decreased steadily with strain. The value of Qd was separated into thermal and mechanical parts. The thermal part was necessary to propel diffusion. For pure Ni, the mechanical part was zero at low and medium strain rates of 0.001–0.1 s−1 and the self-diffusion was the controlling mechanism. However, at 1 s−1, both the thermal and mechanical parts were needed to provide Qd. For Ni–30Cu, Qd was greater than that for the interdiffusion of Ni and Cu. The value of mechanical part decreased with increasing temperature and strain rate. Although the thermal parts for pure Ni and Ni–30Cu were nearly identical, the mechanical part for the latter was considerably higher. The difference was attributed to the strengthening effect of Cu atoms and the sluggish dynamic softening with respect to pure Ni.

Keywords

hot pressingstress/strain relationshipNi
Type
Articles
Information
Journal of Materials Research , Volume 31 , Issue 8 , 28 April 2016 , pp. 1077 - 1084
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Copyright
Copyright © Materials Research Society 2016 

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