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Origins of microplasticity in low-load scratching of silicon

Published online by Cambridge University Press:  03 March 2011

J.C. Morris  and
D.L. Callahan
J.C. Morris
Affiliation:
Department of Mechanical Engineering and Materials Science, Rice University, Houston, Texas 77251
D.L. Callahan
Affiliation:
Department of Mechanical Engineering and Materials Science, Rice University, Houston, Texas 77251
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Abstract

Microstructural characterization of silicon wafers subjected to controlled low-load scratching with a sharp indenter reveals that considerable plastic deformation occurs prior to the onset of fracture. In particular, a completely ductile response to scratching is observed at or below a Vickers load of 1 g, corresponding to penetration depths of 200 nm or less. This anomalous plasticity arises primarily as a result of a pressure-induced semiconductor-to-metal phase transition (Mott transition). Various levels of subsurface dislocation activity and cracking also contribute to the deformation. The relationships among the phase transformation, dislocation activity, and the onset of fracture are discussed. These findings can be applied to other areas of contact damage demonstrating anomalous plasticity, such as hardness testing and ductile-regime turning.

Type
Articles
Information
Journal of Materials Research , Volume 9 , Issue 11 , November 1994 , pp. 2907 - 2913
Copyright
Copyright © Materials Research Society 1994

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References

REFERENCES

1Minomura, S. and Drickamer, H. G., Phys. Chem. Solids 23, 451 (1962).CrossRefGoogle Scholar
2Wentorf, R. H. and Kasper, J. S., Science 139, 338 (1963).CrossRefGoogle Scholar
3Jameison, J. C., Science 139, 762 (1963).CrossRefGoogle Scholar
4Hu, J. Z., Merkle, L. D., Menoni, C. S., and Spain, I. L., Phys. Rev. B 34, 4679 (1986).CrossRefGoogle Scholar
5Shimomura, O., Minomura, S., Sakai, N., Asaumi, K., Tamura, K., Fukushima, J., and Endo, H., Philos. Mag. 29, 547 (1974).CrossRefGoogle Scholar
6Gridneva, I. V., Milman, Yu. V., and Trefilov, V.I., Phys. Status Solidi A 14, 177 (1972).CrossRefGoogle Scholar
7Gerk, A. P. and Tabor, D., Nature 271, 732 (1978).CrossRefGoogle Scholar
8Gilman, J. J., J. Mater. Res. 7, 535 (1992).CrossRefGoogle Scholar
9Gilman, J. J., Int. J. Impact Eng. 14, 291 (1993).CrossRefGoogle Scholar
10Hill, M. J. and Rowcliffe, D. J., J. Mater. Sci. 9, 1569 (1974).CrossRefGoogle Scholar
11Puttick, K. E., Shahid, M. A., and Hosseini, M. M., J. Phys. D: Appl. Phys. 12, 195 (1975).CrossRefGoogle Scholar
12Clarke, D. R., Kroll, M. C., Kirchner, P. D., Cook, R. F., and Hockey, B. J., Phys. Rev. Lett. 21, 2156 (1988).CrossRefGoogle Scholar
13Pharr, G. M., Oliver, W. C., and Harding, D. S., J. Mater. Res. 6, 1129 (1991).CrossRefGoogle Scholar
14Callahan, D. L. and Morris, J. C., J. Mater. Res. 7, 1614 (1992).CrossRefGoogle Scholar
15Blake, P. N. and Scattergood, R. O., J. Am. Ceram. Soc. 73, 949 (1990).CrossRefGoogle Scholar
16Puttick, K. E., Jeynes, C., Rudman, M., Gee, A. E., and Chao, C. L., Semicond. Sci. Technol. 7, 255 (1992).CrossRefGoogle Scholar
17Scott, C. G. and Danyluk, S., Wear 152, 183 (1992).CrossRefGoogle Scholar
18Kim, D. E. and Suh, N. P., J. Mater. Sci. 28, 3895 (1993).CrossRefGoogle Scholar
19Johansson, S. and Schweitz, J., J. Am. Ceram. Soc. 71, 617 (1988).CrossRefGoogle Scholar
20Johansson, S., Schweitz, J., and Lagerlof, K. P., J. Am. Ceram. Soc. 72, 1136 (1989).CrossRefGoogle Scholar
21Nadimpalli, C., Friction and Wear Behavior of Silicon Under Conditions of slinding Ph.D. Dissertation, The Ohio State University, Columbus, OH (1992).Google Scholar
22Cook, R. F. and Pharr, G. M., J. Am. Ceram. Soc. 73, 787 (1990).CrossRefGoogle Scholar
23Blackley, W. S. and Scattergood, R. O., J. Am. Ceram. Soc. 73, 3113 (1990).CrossRefGoogle Scholar
24Pharr, G. M., in Thin Films: Stresses and Mechanical Properties III, edited by Nix, W. D., Bravman, J. C., Arzt, E., and Freund, L. B. (Mater. Res. Soc. Symp. Proc. 239, Pittsburgh, PA, 1992), p. 301.Google Scholar
25Morris, J. C., Callahan, D. L., Kulik, J., Patten, J. A., and Scattergood, R. O., unpublished.Google Scholar
26Puttick, K. E., Whitmore, L. C., Chao, C. L., and Gee, A. E., Philos. Mag. A 69, 91 (1994).CrossRefGoogle Scholar