Hostname: page-component-78c5997874-j824f Total loading time: 0 Render date: 2024-11-05T04:18:58.267Z Has data issue: false hasContentIssue false
  • English
  • Français

A new method for measuring the strength and ductility of thin films

Published online by Cambridge University Press:  31 January 2011

David T. Read  and
James W. Dally
David T. Read
Affiliation:
Materials Reliability Division, National Institute of Standards and Technology, Boulder, Colorado 80303-3328
James W. Dally
Affiliation:
Mechanical Engineering Department, University of Maryland, College Park, Maryland 20742
Get access

Abstract

A new method of measuring the mechanical strength of thin films is described. We prepare miniature arrays of four tensile specimens, each 0.25 mm wide, 1 mm long, and 2.2 μm thick, using deposition, patterning, and etching processes common to the semiconductor industry. Each array of four specimens is carried on and protected by a rectangular silicon frame. Thirty-six such specimens are produced on a single wafer. After a specimen frame is mounted, its vertical sides are severed without damaging the specimens. The load is applied by micrometers through a special tension spring. Tensile properties of a 2.2 μm thick Ti–Al–Ti film were determined.

Type
Articles
Information
Journal of Materials Research , Volume 8 , Issue 7 , July 1993 , pp. 1542 - 1549
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Steinwall, J. E. and Johnson, H. H. in Thin Films: Stresses and Mechanical Properties II, edited by Doerner, M. F.Oliver, W. C.Pharr, G. M. and Brotzen, F. R. (Mater. Res. Soc. Symp. Proc. 188, Pittsburgh, PA, 1990), pp. 177–182.Google Scholar
2Hoffman, R. W. in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J. C.Nix, W. D.Barnett, D. M. and Smith, D. A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), pp, 295–306.Google Scholar
3Rosenmayer, C. T.Brotzen, F. R. and Gale, R. J. in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J. C.Nix, W.D.Barnett, D.M. and Smith, D.A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), pp. 77–86.Google Scholar
4Kim, I. and Weil, R.Testing of Metallic and Inorganic Coatings, edited by Harding, W. B. and DiBari, G. A. (American Society for Testing Materials, STP 947, Philadelphia, PA, 1990), pp. 177–182.Google Scholar
5Weihs, T.P.Hong, S. J.Bravman, C. an d Nix, W.D. in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J. C., Nix, W. D.Barnett, D. M. and Smith, D. A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), pp. 87–98.Google Scholar
6Nix, W.D.Metall. Trans. 20A, 2217–2245 (1989).CrossRefGoogle Scholar
7Fan, L. S.Howe, R. T. and Muller, R. S.Sensors and Actuators A21-A23, 872–874 (1990).CrossRefGoogle Scholar
8Mehregany, M.Howe, R.T. and Senturia, S.D.J. Appl. Phys. 62, 3579–3584 (1987).CrossRefGoogle Scholar
9Lee, D.B.J. Appl. Phys. 40, 4569–4574 (1969).CrossRefGoogle Scholar
10Mehregany, M. and Senturia, S.D.Sensors and Actuators 13, 375–390 (1988).CrossRefGoogle Scholar