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Morphology of instability of the wetting tips of eutectic SnBi, eutectic SnPb, and pure Sn on Cu

Published online by Cambridge University Press:  03 March 2011

H.K. Kim ,
H.K. Liou  and
K.N. Tu
H.K. Kim
Affiliation:
Department of Materials Science and Engineering, University of California-Los Angeles, Los Angeles, California 90024-1595
H.K. Liou
Affiliation:
Department of Materials Science and Engineering, University of California-Los Angeles, Los Angeles, California 90024-1595
K.N. Tu
Affiliation:
Department of Materials Science and Engineering, University of California-Los Angeles, Los Angeles, California 90024-1595
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Abstract

The Pb-based solder used in microelectronics industry is becoming an environmental issue. To understand the wetting behavior of solders with and without Pb, we have studied the surface morphology and wetting reaction of eutectic SnBi, eutectic SnPb, and pure Sn on Cu through the measurements of wetting angle change and wetting tip stability by SEM and EDX. The wetting angle remains constant after the initial spread, but the eutectic SnPb/Cu continues to react and forms a reaction band in front of the solder edge as well as intermetallic compounds at the interface. For eutectic SnBi/Cu, there is no reaction at the wetting tip, and the wetting angle does not change much; however, the interfacial reaction between eutectic SnBi and Cu forms intermetallic compounds at the solder joint; the wetting tip is not in a static equilibrium. A rough surface and edge was observed on the eutectic SnBi/Cu joint, but the eutectic SnPb/Cu has a smoother surface and edge.

Type
Environmentally Benign Materials and Processes
Information
Journal of Materials Research , Volume 10 , Issue 3 , March 1995 , pp. 497 - 504
Copyright
Copyright © Materials Research Society 1995

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