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Microstructures and mechanical properties of Sn–8.55Zn–0.45Al–XAg solders

Published online by Cambridge University Press:  31 January 2011

Chia-Wei Huang  and
Kwang-Lung Lin
Chia-Wei Huang
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701, Taiwan, Republic of China
Kwang-Lung Lin
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701, Taiwan, Republic of China
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Abstract

The microstructure, melting point, and mechanical properties of Sn–8.55Zn–0.45Al–XAg lead-free solders were investigated. The Ag content of the solders investigated was 0–3 wt.%. The results indicate that the AgZn3 and Ag5Zn8 compounds are formed at the addition of Ag to Sn–8.55Zn–0.45Al solders. The adding of Ag also results in the formation of hypoeutectic structure, increasing the melting point of the solders and decreasing the ductility. Results of thermal analysis reveal that the Sn–8.55Zn–0.45Al–XAg solder has eutectic temperature at 198 °C when the addition of Ag is 0.5 wt.%. The eutectic solder exhibits greater tensile strength and higher ductility than the 63–Sn–37Pb solder.

Type
Articles
Information
Journal of Materials Research , Volume 18 , Issue 7 , July 2003 , pp. 1528 - 1534
Copyright
Copyright © Materials Research Society 2003

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