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Microstructure, mechanical, and electrical properties of Cu–Ti3AlC2 and in situ Cu–TiCx composites

Published online by Cambridge University Press:  31 January 2011

J. Zhang  and
Y.C. Zhou
J. Zhang
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China; and Graduate School of Chinese Academy of Sciences, Beijing 100039, People’s Republic of China
Y.C. Zhou*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Two kinds of composites (i.e., conductive and strong Cu–Ti3AlC2 composites) were prepared at 850 °C, while high-strength in situ Cu–TiCx composites were prepared by consolidation at 850 °C and then hot pressing at 1000 °C. In both kinds of composites, the reinforcements were uniformly distributed within the Cu matrix. In Cu–Ti3AlC2 composites, strengthening was achieved by the load transfer through a strong interfacial layer consisting of TiCx and Cu(Al), which was formed by the partial deintercalation of Al from Ti3AlC2. For the in situ Cu–TiCx composites, the higher modulus of TiCx as well as the highly twinned structure formed during processing contributed to the enhancement of strength. It was demonstrated that the deintercalation of Al from Ti3AlC2 formed substoichiometric Ti3AlxC2 (with x < 1), and no detrimental effect on the electrical conductivity was observed.

Keywords

CeramicCompositeCu
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 4 , April 2008 , pp. 924 - 932
Copyright
Copyright © Materials Research Society 2008

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