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Microstructure evolution and microimpact performance of Sn–Ag–Cu solder joints under thermal cycle test

Published online by Cambridge University Press:  31 January 2011

Y.L. Huang ,
K.L. Lin  and
D.S. Liu
K.L. Lin
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 70101, Republic of China
D.S. Liu
Affiliation:
Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi, Taiwan 62102, Republic of China
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Abstract

The microstructure and microimpact performance of Sn1Ag0.1Cu0.02Ni0.05In (SAC101NiIn)/AuNi/Cu solder ball joints were investigated after a thermal cycle test (TCT). The joints show complete bulk fracture behavior before TCT. Moreover, TCT facilitated interfacial fracture behavior with lower fracture energy. The intermetallic compounds (IMCs) formed in the solder joints before and after TCT were investigated. TCT induces a variety of structural variations in the solder joints, including slipping bands, whisker formation, the squeezing of the IMC layer, the formation of cavities, the rotation and pop-up of grain, and the deformation and rotation of the entire joint. The variations in fracture behavior induced by TCT are correlated with the structural variations in the solder joints.

Keywords

FatigueMicrostructureFracture
Type
Articles
Information
Journal of Materials Research , Volume 25 , Issue 7 , July 2010 , pp. 1312 - 1320
Copyright
Copyright © Materials Research Society 2010

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