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Microstructure and thermal conductivity of hypereutectic Al-high Si produced by casting and spray deposition

Published online by Cambridge University Press:  09 September 2016

Yandong Jia ,
Fuyang Cao ,
Pan Ma ,
Sergio Scudino ,
Jürgen Eckert ,
Jianfei Sun  and
Gang Wang
Yandong Jia
Affiliation:
Institute of Materials, Shanghai University, Shanghai 200444, China; and School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China
Fuyang Cao
Affiliation:
School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China
Pan Ma
Affiliation:
School of Materials Engineering, Shanghai University of Engineering Science, Shanghai 201620, China
Sergio Scudino
Affiliation:
IFW Dresden, Institute for Complex Materials, D-01171 Dresden, Germany
Jürgen Eckert
Affiliation:
Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstraße 12, A-8700 Leoben, Austria; and Department Materials Physics, Montanuniversität Leoben, Jahnstraße 12, A-8700 Leoben, Austria
Jianfei Sun
Affiliation:
School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China
Gang Wang*
Affiliation:
Institute of Materials, Shanghai University, Shanghai 200444, China
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

The Al–50Si alloy, as a kind of potential electronic packaging material, is manufactured by different methods, such as casting and spray deposition. The possible influences of the P refiner on the microstructure of the Al–50Si alloy are investigated at different cooling rates. The refinement mechanism of primary Si phase is discussed in view of the P refiner addition, and the variation of the cooling rates. The thermal conductivity (TC), as a key parameter for electronic materials, is measured. The coupled effects of the cooling rate and the addition of the P refiner during the solidification of the Al–50Si alloy on the TC are elucidated based on structural observations. Furthermore, the porosity in the Al–50Si alloy is treated as a second phase influencing the TC.

Keywords

spray-depositedhypereutectic Al-high Si alloysmicrostructurethermal conductivity
Type
Articles
Information
Journal of Materials Research , Volume 31 , Issue 19 , 14 October 2016 , pp. 2948 - 2955
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Copyright
Copyright © Materials Research Society 2016 

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References

REFERENCES

Zhang, Q., Wu, G.H., Jiang, L.T., and Chen, G.Q.: Thermal expansion and dimensional stability of Al–Si matrix composite reinforced with high content SiC. Mater. Chem. Phys. 82, 780–785 (2003).CrossRefGoogle Scholar
Jia, Q.J., Liu, J.Y., Li, Y.X., and Wang, W.S.: Microstructure and properties of electronic packaging box with high silicon aluminum-base alloy by semi-solid thixoforming. Trans. Nonferrous Met. Soc. China 23, 80–85 (2013).Google Scholar
Cai, Z.Y., Wang, R.C., Zhang, C., Peng, C.Q., Feng, Y., and Wang, L.Q.: Thermal cycling reliability of Al/50Sip composite for thermal management in electronic packaging. J. Mater. Sci.: Mater. Electron. 26, 4894–4901 (2015).Google Scholar
Hogg, S.C., Lambourne, A., Ogilvy, A., and Grant, P.S.: Microstructural characterisation of spray formed Si–30Al for thermal management applications. Scripta Mater. 55, 111–114 (2006).Google Scholar
Chien, C.W., Lee, S.L., Lin, J.C., and Jahn, M.T.: Effects of Sip size and volume fraction on properties of Al/Sip composites. Mater. Lett. 52, 334–341 (2002).Google Scholar
Jacobson, D.M., Ogilvy, A.J.W., and Leatham, A.G.: Applications of Osprey lightweight controlled expansion (CE) alloys. Tech. Rep., 1–12 (2004).Google Scholar
Rao, A.G., Rao, B.R.K., Deshmukh, V.P., Shah, A.K., and Kashyap, B.: Microstructural refinement of a cast hypereutectic Al–30Si alloy by friction stir processing. Mater. Lett. 63, 2628–2630 (2009).Google Scholar
Goudar, D.M., Raju, K., Srivastava, V.C., and Rudrakshi, G.B.: Effect of copper and iron on the wear properties of spray formed Al–28Si alloy. Mater. Des. 51, 383–390 (2013).Google Scholar
Ma, P., Zou, C.M., Wang, H.W., Scudino, S., Fu, B.G., Wei, Z.J., Kühn, U., and Eckert, J.: Effects of high pressure and SiC content on microstructure and precipitation kinetics of Al–20Si alloy. J. Alloys Compd. 586, 639–644 (2014).CrossRefGoogle Scholar
Li, D.K., Zuo, M., Zhang, Q., and Liu, X.F.: The investigation of continuous nucleation and refinement of primary Si in Al–30Si mushy zone. J. Alloys Compd. 502, 304–309 (2010).Google Scholar
Cao, F.Y., Jia, Y.D., Ma, P., Prashanth, K.G., Liu, J.S., Scudino, S., Huang, F., Eckert, J., and Sun, J.F.: Evolution of microstructure and mechanical properties of as-cast Al–50Si alloy due to heat treatment and P modifier content. Mater. Des. 74, 150–156 (2015).Google Scholar
Zhang, L., Gan, G.S., and Yang, B.: Microstructure and property measurements on in situ TiB2/70Si–Al composite for electronic packaging applications. Mater. Des. 36, 177–181 (2012).Google Scholar
Zhu, X.W., Wang, R.C., Peng, C.Q., Liu, W.S., and Peng, J.: Microstructure and thermal expansion behavior of spray-formed Al–27Si alloy used for electronic packaging. J. Mater. Sci.: Mater. Electron. 25, 4889–4895 (2014).Google Scholar
Hong, S.J. and Suryanarayana, C.: Mechanical properties and fracture behavior of an ultrafine-grained Al–20 wt pct Si alloy. Metall. Mater. Trans. A 36, 715–723 (2005).CrossRefGoogle Scholar
Yu, S.R., Feng, H.K., Li, Y.L., and Gong, L.Y.: Study on the properties of Al–23%Si alloy treated by ultrasonic wave. J. Alloys Compd. 484, 360–364 (2009).Google Scholar
Wang, F., Xiong, B.Q., Zhang, Y.A., Zhu, B.H., Liu, H.W., and We, Y.G.: Microstructure, thermo-physical and mechanical properties of spray-deposited Si–30Al alloy for electronic packaging application. Mater. Charact. 59, 1455–1457 (2008).CrossRefGoogle Scholar
Cui, C., Schulz, A., Schimanski, K., and Zoch, H.W.: Spray forming of hypereutectic Al–Si alloys. J. Mater. Process. Technol. 209, 5220–5228 (2009).Google Scholar
Jia, Y.D., Cao, F.Y., Scudino, S., Ma, P., Li, H.C., Yu, L., Yu, L., Eckert, J., and Sun, J.F.: Microstructure and thermal expansion behavior of spray-deposited Al–50Si. Mater. Des. 57, 585–591 (2014).Google Scholar
Dai, H.S. and Liu, X.F.: Refinement performance and mechanism of an Al–50Si alloy. Mater. Charact. 59, 1559–1563 (2008).Google Scholar
Sastry, K.Y., Froyen, L., Vleugels, J., Bentefour, E.H., and Glorieux, C.: Effect of porosity on thermal conductivity of Al–Si–Fe–X alloy powder compacts. Int. J. Thermophys. 25, 1611–1622 (2004).Google Scholar
Rudajevová, A.: Thermal diffusivity and thermal conductivity of Ni53.6Mn27.1Ga19.3 shape memory alloy. Int. J. Therm. Sci. 47, 1243–1248 (2008).Google Scholar
Dai, H.S. and Liu, X.F.: The combined effect of titanic carbide and aluminum phosphide on the refinement of primary silicon in Al–50Si alloy. Int. J. Mater. Res. 99, 1379–1383 (2008).Google Scholar
Zhang, Q., Liu, X.F., and Dai, H.S.: Re-formation of AlP compound in Al–Si melt. J. Alloys Compd. 480, 376–381 (2009).Google Scholar
Zuo, M., Zhao, D.G., Teng, X.Y., Geng, H.R., and Zhang, Z.S.: Effect of P and Sr complex modification on Si phase in hypereutectic Al–30Si alloys. Mater. Des. 47, 857–864 (2013).Google Scholar
Kobayashi, K.F. and Hogan, L.M.: The crystal growth of silicon in Al–Si alloys. J. Mater. Sci. 20, 1961–1975 (1985).Google Scholar
Wang, R.Y., Lu, W.H., and Hogan, L.M.: Growth morphology of primary silicon in cast Al–Si alloys and the mechanism of concentric growth. J. Cryst. Growth 207, 43–54 (1999).Google Scholar
Grant, P.S.: Solidification in spray forming. Metall. Mater. Trans. A 38, 1520–1529 (2007).Google Scholar
Okumus, S.C., Aslan, S., Karslioglu, R., Gultekin, D., and Akbulut, H.: Thermal expansion and thermal conductivity behaviors of Al–Si/SiC/graphite hybrid metal matrix composites. Mater. Sci. 18, 341–346 (2012).Google Scholar
Chihiro, K.W.: Effect of interfacial reaction on the thermal conductivity of Al–SiC composites with SiC dispersions. J. Am. Ceram. Soc. 84, 896–898 (2001).Google Scholar
Molina, J.M., Narciso, J., Weber, L., Mortensen, A., and Louis, E.: Thermal conductivity of Al–SiC composites with monomodal and bimodal particle size distribution. Mater. Sci. Eng., A 480, 483–488 (2008).Google Scholar
Abdullah, Y., Daud, A.R., Harun, M., and Shamsudin, R.: Investigation of thermal properties of Al–Si matrix reinforced fine SiCp composites. Mater. Sci. Technol. 26, 1518–1520 (2010).Google Scholar
Pitchumani, R., Liaw, P.K., Yao, S.C., Hsu, D.K., and Jeong, H.: Theoretical models for the anisotropic conductivities of two-phase and three-phase metal–matrix composites. Acta Metall. 43, 3045–3059 (1995).Google Scholar
Molina, J.M., Prieto, R., Narciso, J., and Louis, E.: The effect of porosity on the thermal conductivity of Al–12 wt% Si/SiC composites. Scripta Mater. 60, 582–585 (2009).CrossRefGoogle Scholar