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Microstructure and texture evolution of novel Cu–10Ni–3Al–0.8Si alloy during hot deformation

Published online by Cambridge University Press:  29 March 2016

Leinuo Shen
Affiliation:
Department of Material Physics and Chemistry, School of Materials Science and Engineering, Central South University, Changsha 410083, Hunan, China
Zhou Li*
Affiliation:
Department of Material Physics and Chemistry, School of Materials Science and Engineering, Central South University, Changsha 410083, Hunan, China
Qiyi Dong
Affiliation:
Department of Material Physics and Chemistry, School of Materials Science and Engineering, Central South University, Changsha 410083, Hunan, China; and State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, Hunan, China
Zhu Xiao
Affiliation:
Department of Material Physics and Chemistry, School of Materials Science and Engineering, Central South University, Changsha 410083, Hunan, China
Chang Chen
Affiliation:
Department of Metallic Materials, School of Materials Science and Engineering, Heifei University of Technology, Heifei 230009, Anhui, China
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

The influence of temperature and strain rate on hot deformation behavior and microstructure of Cu–10Ni–3Al–0.8Si alloy was investigated. The true stress increased rapidly initially until it approached the peak values. The peak value of true stress and the Zener–Hollomon parameter decreased with the increase of temperature and the decrease of strain rate. The thermal activation energy of the alloy was about 396.57 kJ/mol, the processing map was established and the appropriate compression temperature was between 900 and 950 °C. The 〈001〉 and 〈011〉 fiber texture was the main type of texture. The increase of temperature or strain rate accelerated the formation of 〈001〉 fiber texture. Dynamic recrystallization nucleated and deformation bands formed at 750 °C. Recrystallization was accelerated with the increase of temperature and the decrease of Zener–Hollomon parameter. Both continuous recrystallization resulting from dynamic recovery and dynamic discontinuous recrystallization were softening mechanisms.

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Articles
Copyright
Copyright © Materials Research Society 2016 

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