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Layered intermetallic compounds and stress evolution in Sn and Ni(P) films

Published online by Cambridge University Press:  31 January 2011

Jae Yong Song
Jae Yong Song
Affiliation:
Division of Advanced Technology, Korea Research Institute of Standards and Science, Yuseong-gu, Daejeon, 305-600, South Korea
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Abstract

In situ measurements of stresses due to the phase transformation in Sn and Ni(P) films were analyzed relating to the formation of layered intermetallic compounds such as Ni3Sn4, Ni3Sn2, Ni3P, and the crystallization of Ni(P) films. When Sn/Ni(11.7P) films were heated up to 480 °C, the first tensile stress developed due to formation of Ni3Sn4 and Ni3P around 220 °C, and the second one appeared at 335 °C due to formation of Ni3Sn2 as well as the self-crystallization of Ni(11.7P). For Sn/Ni(3P), a tensile stress developed mildly with the temperature between 300 and 410 °C due to formation of Ni3Sn2 and precipitation of Ni3P. The onset temperatures of self-crystallization of Ni(P) and Ni3P precipitation decreased due to the Ni–Sn reaction.

Keywords

LayeredPhase transformation
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 7 , July 2007 , pp. 2025 - 2031
Copyright
Copyright © Materials Research Society 2007

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