The kinetics of silicon carbide (SiC) deposition, in a hot-wall chemical vapor deposition (CVD) reactor, were modeled by analyzing our own deposition rate data as well as reported results. In contrast to the previous attempts which used only the first order lumped reaction scheme, the present model incorporates both homogeneous gas phase and heterogeneous surface reactions. The SiC deposition process was modeled using the following reactions: (i) gas phase decomposition of methyltrichlorosilane (MTS) molecules into two major intermediates, one containing silicon and the other containing carbon, (ii) adsorption of the intermediates onto the surface sites of the growing film, and (iii) reaction of the adsorbed intermediates to form silicon carbide. The equilibrium constant for the gas phase decomposition process was divided into the forward and backward reaction constants as 2.0 × 1025 exp[(448.2 kJ/mol)/RT] and 1.1 × 1032 exp[(-416.2 kJ/mol)/RT], respectively. Equilibrium constants for the surface adsorption reactions of silicon-carrying and carbon-carrying intermediates are 0.5 × 1011 exp[(-21.6 kJ/mol)/RT] and 7.1 × 109 exp[(-33.1 kJ/mol)/RT], while the rate constant for the surface reaction of the intermediates is 4.6 × 105 exp[(-265.1 kJ/mol)/RT].