Hostname: page-component-586b7cd67f-dsjbd Total loading time: 0 Render date: 2024-11-22T22:41:22.171Z Has data issue: false hasContentIssue false
  • English
  • Français

Intrinsic stresses in compositionally modulated Au-Ni thin films and the supermodulus effect

Published online by Cambridge University Press:  03 March 2011

Shefford P. Baker  and
William D. Nix
Shefford P. Baker
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, California 94305
William D. Nix
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, California 94305
Get access

Abstract

The stresses that arise in compositionally modulated Au-Ni thin films as a result of the constraint of the substrate were determined from the curvatures of micrometer-scale bilayer cantilever beams consisting of a silicon dioxide layer upon which the metal film had been deposited. These substrate interaction stresses were found to vary strongly with the wavelength of the composition modulation. Simulations of the bulge test show that such stresses can account for the major features of the “supermodulus effect” as artifacts of the analysis method.

Type
Articles
Information
Journal of Materials Research , Volume 9 , Issue 12 , December 1994 , pp. 3145 - 3152
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Yang, W. M. C., Tsakalakos, T., and Hilliard, J. E., J. Appl. Phys. 48, 876 (1977).CrossRefGoogle Scholar
2Testardi, L. R., Willens, R. H., Krause, J. T., McWhan, D.B., andNakahara, S., J. Appl. Phys. 52, 510 (1981).CrossRefGoogle Scholar
3Hénein, G.E. and Hilliard, J.E., J. Appl. Phys. 54, 728 (1983).CrossRefGoogle Scholar
4Tsakalakos, T. and Hilliard, J. E., J. Appl. Phys. 54, 734 (1983).CrossRefGoogle Scholar
5Baral, D., Ketterson, J. B., and Hilliard, J. E., J. Appl. Phys. 57, 1076 (1985).CrossRefGoogle Scholar
6Jankowski, A. and Tsakalakos, T., J. Appl. Phys. 57, 1835 (1985).CrossRefGoogle Scholar
7Baker, S. P. and Nix, W. D., J. Mater. Res. 9, xxx (1994).Google Scholar
8Nix, W. D., Metall. Trans. A 20A, 2217 (1989).CrossRefGoogle Scholar
9Cammarata, R. C. and Sieradzki, K., Phys. Rev. Lett. 62, 2005 (1989).CrossRefGoogle Scholar
10Ruud, J. A., Witvrouw, A., and Spaepen, F., J. Appl. Phys. 74, 2517 (1993).CrossRefGoogle Scholar
11Itozaki, H., Ph.D. Dissertation, Northwestern University (1982).Google Scholar
12Baral, D., Ph.D. Dissertation, Northwestern University (1983).Google Scholar
13Beams, J. W., in Structure and Properties of Thin Films, edited by Neugebauer, C. A., Newkirk, J. B., and Vermilyea, D. A. (John Wiley and Sons, New York, 1959), p. 183.Google Scholar
14Simmons, G. and Wang, H., Single Crystal Elastic Constants and Calculated Aggregate Properties: A Handbook (M.I.T. Press, Cambridge, MA, 1971).Google Scholar
15Weihs, T. P., Ph.D. Dissertation, Stanford University (1990).Google Scholar
16Bain, J. A., Chyung, L. J., Brennan, S., and Clemens, B. M., Phys. Rev. B 44, 1184 (1991).CrossRefGoogle Scholar
17Gumbsch, P. and Daw, M. S., Phys. Rev. B 44, 3934 (1991).CrossRefGoogle Scholar
18Berry, B. S. and Pritchet, W. C., Thin Solid Films 33, 19 (1976).CrossRefGoogle Scholar
19Davis, B. M., Seidman, D. N., Moreau, A., Ketterson, J. B., Mattson, J., and Grimsditch, M., Phys. Rev. B 43, 9304 (1991).CrossRefGoogle Scholar
20Davis, B. M., Li, D. X., Seidman, D. N., Ketterson, J. B., Bhadra, R., and Grimsditch, M., J. Mater. Res. 7, 1356 (1992).CrossRefGoogle Scholar
21Cammarata, R. C., Schlesinger, T. E., Kim, C., Qadri, S. B., and Edelstein, A. S., Appl. Phys. Lett. 56, 1862 (1990).CrossRefGoogle Scholar
22Small, M. K., Daniels, B. J., Clemens, B. M., and Nix, W. D., J. Mater. Res. 9, 25 (1994).CrossRefGoogle Scholar
23Dutcher, J. R., Lee, S., Kim, J., Stegeman, G. I., and Falco, CM., Phys. Rev. Lett. 65, 1231 (1990).CrossRefGoogle Scholar
24Mattson, J., Bhadra, R., Ketterson, J. B., Brodsky, M., and Grimsditch, M., J. Appl. Phys. 67, 2873 (1990).CrossRefGoogle Scholar
25Moreau, A., Ketterson, J. B., and Mattson, J., Appl. Phys. Lett. 56, 1959 (1990).CrossRefGoogle Scholar
26Moreau, A., Ketterson, J. B., and Davis, B., J. Appl. Phys. 68, 1622 (1990).CrossRefGoogle Scholar
27Pharr, G. M., in Materials Reliability in Microelectronics TV, edited by Borgesen, P., Sanchez, J. E. Jr., Coburn, J. C., Rodbell, K., and Filter, W. (Mater. Res. Soc. Symp. Proc, Pittsburgh, PA, 1994), in press.Google Scholar
28Small, M. K. and Nix, W. D., J. Mater. Res. 7, 1553 (1992).CrossRefGoogle Scholar
29Vlassak, J. J. and Nix, W. D., J. Mater. Res. 7, 3242 (1992).CrossRefGoogle Scholar