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Interface modifications for improving the adhesion of a-C:H films to metals

Published online by Cambridge University Press:  31 January 2011

A. Grill ,
B. Meyerson  and
V. Patel
A. Grill
Affiliation:
IBMT. J. Watson Research Center, Yorktown Heights, New York 10598
B. Meyerson
Affiliation:
IBMT. J. Watson Research Center, Yorktown Heights, New York 10598
V. Patel
Affiliation:
IBMT. J. Watson Research Center, Yorktown Heights, New York 10598
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Abstract

The adhesion of diamondlike hard carbon films to silicide forming metals was improved by using an interfacial silicon film several atomic layers thick. The use of thicker (> 10nm) silicon layers results in a decrease in the adhesion, probably due to a degradation of the structural integrity by excessive silicide formation.

Type
Rapid Communications
Information
Journal of Materials Research , Volume 3 , Issue 2 , April 1988 , pp. 214 - 217
Copyright
Copyright © Materials Research Society 1988

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