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Interface microstructures between Ni-P alloy plating and Sn–Ag–(Cu) lead-free solders

Published online by Cambridge University Press:  31 January 2011

Chi-Won Hwang ,
Katsuaki Suganuma ,
Masayuki Kiso  and
Shigeo Hashimoto
Chi-Won Hwang
Affiliation:
Institute of Scientific and Industrial Research, Osaka University Mihogaoka 8-1, Ibaraki, Osaka, 567-0047, Japan
Katsuaki Suganuma
Affiliation:
Institute of Scientific and Industrial Research, Osaka University Mihogaoka 8-1, Ibaraki, Osaka, 567-0047, Japan
Masayuki Kiso
Affiliation:
C. Uyemura & Co., Ltd. Deguchi 1-5-1, Hirakata, Osaka, 573-0065, Japan
Shigeo Hashimoto
Affiliation:
C. Uyemura & Co., Ltd. Deguchi 1-5-1, Hirakata, Osaka, 573-0065, Japan
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Abstract

The interface microstructures of Sn-Ag and Sn-Ag-Cu solders with Au/Ni-6P plating were studied primarily using transmission electron microscopy. During soldering at 230°C, Au dissolved into molten solder, and double reaction layers of Ni3Sn4/η–Ni3SnP formed between Sn-3.5Ag solder and Ni-6P layer. P content increases in the surface region of the Ni-6P layer due to the depletion of Ni diffused into molten solder, resulting in the formation of Ni3P+Ni layer. For Sn-3.5Ag-0.7Cu solder, an η-(Ni,Cu)3Sn2 single layer, containing Cu of about 50 at.%, formed as a reaction layer.

Type
Rapid Communications
Information
Journal of Materials Research , Volume 18 , Issue 11 , November 2003 , pp. 2540 - 2543
Copyright
Copyright © Materials Research Society 2003

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