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Influence of Y2BaCuO5 particles on the growth morphology of peritectically solidified YBa2Cu3O7−x

Published online by Cambridge University Press:  03 March 2011

G.J. Schmitz
Affiliation:
ACCESS e.V., D-52056 Aachen, Germany
J. Laakmann
Affiliation:
ACCESS e.V., D-52056 Aachen, Germany
Ch. Wolters
Affiliation:
ACCESS e.V., D-52056 Aachen, Germany
S. Rex
Affiliation:
ACCESS e.V., D-52056 Aachen, Germany
W. Gawalek
Affiliation:
IPHT, D-07743 Jena, Germany
T. Habisreuther
Affiliation:
IPHT, D-07743 Jena, Germany
G. Bruchlos
Affiliation:
IPHT, D-07743 Jena, Germany
P. Görnert
Affiliation:
IPHT, D-07743 Jena, Germany
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Abstract

Modifications of a recent model by Izumi et al.1 on diffusion controlled growth of YBa2Cu3O7−x (123) superconductors are proposed, taking into account especially the engulfment process of the Y2BaCuO5 (211) particles into the solidifying 123 interface. The proposed modifications are evidenced by experimental results and applied to explain microstructural features of the 123 superconducting material. In particular, the 1:1 correlation between 123 platelet thickness (planar defect spacing) and 211 particle size as described by Jin et al.2 is explained by an observed bridge growth resulting in a zipper-like mechanism. By this mechanism the platelets grow together in an oriented way leading to a quasi single crystalline material.

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Articles
Copyright
Copyright © Materials Research Society 1993

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References

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