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In situ study on Cu–Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient

Published online by Cambridge University Press:  19 February 2016

Yi Zhong ,
Mingliang Huang ,
Haitao Ma ,
Wei Dong ,
Yunpeng Wang  and
Ning Zhao
Yi Zhong
Affiliation:
Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Mingliang Huang
Affiliation:
Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Haitao Ma
Affiliation:
Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Wei Dong
Affiliation:
Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Yunpeng Wang
Affiliation:
Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Ning Zhao*
Affiliation:
Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

Synchrotron radiation real-time imaging technology was performed to in situ study the Cu–Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient during soldering. The direction of temperature gradient significantly influenced the Cu–Ni cross-interaction. When Ni was the hot end, both Cu and Ni atoms could diffuse to the opposite interfaces, resulting in the occurrence of the Cu–Ni cross-interaction at both interfaces. The consumption of the Cu cold end was abnormally large, whereas that of the Ni hot end was limited. When Cu was the hot end, only Cu atoms could diffuse to the opposite interface, resulting in the occurrence of the Cu–Ni cross-interaction only at the cold end. The Cu hot end was seriously consumed, whereas the Ni cold end was still intact. The interfacial intermetallic compounds were always thicker at the cold end than at the hot end, especially at the Ni/Sn cold end. Cu imposed more damaging effect than Ni under temperature gradient. Based on the atomic fluxes, a model was proposed to discuss the effect of temperature gradient on the Cu–Ni cross-interaction and the interfacial reactions in the Cu/Sn/Ni solder joints.

Keywords

bondingcompoundpackaging
Type
Articles
Information
Journal of Materials Research , Volume 31 , Issue 5 , 14 March 2016 , pp. 609 - 617
Copyright
Copyright © Materials Research Society 2016 

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