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In situ elevated temperature transmission electron microscopy of sensitized aluminum–magnesium alloy treated by ultrasonic impact treatment

Published online by Cambridge University Press:  15 July 2014

Kim N. Tran ,
Lourdes Salamanca-Riba  and
Wen-An Chiou
Kim N. Tran*
Affiliation:
Survivability, Structures, and Materials, Naval Surface Warfare Center, Carderock Division, West Bethesda, Maryland 20817, USA
Lourdes Salamanca-Riba
Affiliation:
Materials Science and Engineering Department, University of Maryland, College Park, Maryland 20742, USA
Wen-An Chiou
Affiliation:
Nanoscale Imaging, Spectroscopy, and Properties Laboratory, NanoCenter, University of Maryland, Maryland 20742, USA
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

In situ transmission electron microscopy (TEM) analysis shows that submicrometer grains formed by ultrasonic impact treatment (UIT) of sensitized 5456-H116 Al–Mg alloy products are thermally stable up to ∼300 °C which is consistent with previous research on annealing of heavily deformed Al–Mg. Grain growth occurs above 300 °C with significant growth at ∼400 °C. Grain growth continued upon heating to 450 °C; the grain size did not significantly increase when the temperature was held at 450 °C long term. In situ TEM revealed a duplex microstructure that was not fully recrystallized. The activation energy for grain growth was determined to be ∼32 kJ/mol. The submicrometer grains produced by UIT offer improved resistance to fatigue and corrosion. The majority of sensitized 5456-H116 failures are sensitive to the material's surface properties and operational service temperature; the stability of the submicrometer grains in the UIT Al–Mg makes them more stable in practical operations where increase in the material temperature is an issue.

Keywords

Alannealingtransmission electron microscopy
Type
Articles
Information
Journal of Materials Research , Volume 29 , Issue 13 , 14 July 2014 , pp. 1456 - 1462
Copyright
Copyright © Materials Research Society 2014 

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References

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