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High-tensile ductility in nanocrystalline copper

Published online by Cambridge University Press:  31 January 2011

L. Lu ,
L. B. Wang ,
B. Z. Ding  and
K. Lu
L. Lu
Affiliation:
State Key Laboratory for RSA, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110015, People's Republic of China
L. B. Wang
Affiliation:
State Key Laboratory for RSA, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110015, People's Republic of China
B. Z. Ding
Affiliation:
State Key Laboratory for RSA, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110015, People's Republic of China
K. Lu*
Affiliation:
State Key Laboratory for RSA, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110015, People's Republic of China
*
a) Author to whom correspondence should be addressed.[email protected]
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Abstract

In this work we report a high-tensile ductility in a fully dense bulk nanocrystalline (nc) pure copper sample prepared by electrodeposition. A tensile ductility with an elongation to fracture of 30% was obtained in the nc Cu specimen with an average grain size of 27 nm, which is comparable to that for the coarse-grained polycrystalline Cu. An enhanced yield stress (119 MPa) and a depressed strain hardening exponent (0.22) were observed in the nc Cu sample with respect to the conventional polycrystalline Cu. The high-tensile ductility was attributed to the minimized artifacts in the nc sample, and the grain-boundary sliding deformation mechanism resulted from the numerous amount small-angle grain boundaries and the low microstrain (dislocation density).

Type
Articles
Information
Journal of Materials Research , Volume 15 , Issue 2 , February 2000 , pp. 270 - 273
Copyright
Copyright © Materials Research Society 2000

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References

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