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High-temperature creep of low-dielectric-constant glass composites

Published online by Cambridge University Press:  31 January 2011

Jau-Ho Jean
Jau-Ho Jean
Affiliation:
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan, Republic of China
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Abstract

The constant-stress compressive creep behavior of a low-dielectric constant (low-k) glass composite, containing a low-softening-point borosilicate glass (BSG) and a high-softening-point high silica glass (HSG), has been investigated at 800–950 °C. For all stages of creep, the deformation behavior exhibits linear viscoelasticity, and is controlled by viscous flow of the low-softening-point borosilicate glass. An analytical expression is proposed to describe mathematically the creep behavior of the glass composite, and the results show a fairly good agreement with experimental observations.

Type
Articles
Information
Journal of Materials Research , Volume 11 , Issue 8 , August 1996 , pp. 2098 - 2103
Copyright
Copyright © Materials Research Society 1996

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References

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