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Grain Morphology of Intermetallic Compounds at Solder Joints

Published online by Cambridge University Press:  31 January 2011

Won Kyoung Choi ,
Se-Young Jang ,
Jong Hoon Kim ,
Kyung-Wook Paik  and
Hyuck Mo Lee
Won Kyoung Choi
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Kusung-Dong 373-1, Yusung-Gu, Taejon, Korea 305-701
Se-Young Jang
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Kusung-Dong 373-1, Yusung-Gu, Taejon, Korea 305-701
Jong Hoon Kim
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Kusung-Dong 373-1, Yusung-Gu, Taejon, Korea 305-701
Kyung-Wook Paik
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Kusung-Dong 373-1, Yusung-Gu, Taejon, Korea 305-701
Hyuck Mo Lee*
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Kusung-Dong 373-1, Yusung-Gu, Taejon, Korea 305-701
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

The grain morphology of the intermetallic compound (IMC) that forms at the interface between liquid solders and solid-metal substrates was observed at solder joints. Cu6Sn5 grains on Cu substrates were rough or rounded, and Ni3Sn4 grains on Ni substrates were faceted. Through the energy-based calculations, the relationship between the IMC grain morphology and Jackson's parameter α was explained. The Jackson's parameter of the IMC grain with a rough surface is smaller than 2 while it is larger than 2 for faceted grains.

Type
Articles
Information
Journal of Materials Research , Volume 17 , Issue 3 , March 2002 , pp. 597 - 599
Copyright
Copyright © Materials Research Society 2002

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