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Grain growth kinetics and microstructure in the high Tc YBa2Cu3O7−δ superconductor

Published online by Cambridge University Press:  31 January 2011

M.W. Shin ,
T.M. Hare ,
A.I. Kingon  and
C.C. Koch
M.W. Shin
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27695–7907
T.M. Hare
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27695–7907
A.I. Kingon
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27695–7907
C.C. Koch
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27695–7907
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Abstract

The grain growth and microstructure development of YBa2Cu3O7−δ have been investigated utilizing two different starting particle size distributions (normal and bimodal). The grain growth exponent, n, was found to be about 0.21 for both normal and bimodal samples. An activation energy of 125 kJ/mole was calculated. The low value of n might be attributed to the high anisotropy of grain boundary energy in this system. Samples made from the bimodal powder were found to accelerate grain growth without introducing abnormal grain growth. Although most of the samples attained fractional densities greater than 0.95, the presence of various amounts of porosity (particularly in the case of the bimodal starting powder) did not affect the growth kinetics. The measured aspect ratio of grains did not significantly change during growth. A significant difference in aspect ratio was measured between samples made from the two different starting powders. Critical currents ranged from 10 to 120 A/cm2, but no concrete relationship with grain size was established. This implies that the grains produced by this experiment were in the size range where other factors, presumably microcracking, severely limited the current carrying capacity by the weak link effect.

Type
Articles
Information
Journal of Materials Research , Volume 6 , Issue 10 , October 1991 , pp. 2026 - 2034
Copyright
Copyright © Materials Research Society 1991

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