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Further experiments and modeling for microscale compression molding of metals at elevated temperatures

Published online by Cambridge University Press:  31 January 2011

J. Jiang ,
W.J. Meng ,
G.B. Sinclair  and
E. Lara-Curzio
J. Jiang
Affiliation:
Department of Mechanical Engineering, Louisiana State University, Baton Rouge, Louisiana 70803
W.J. Meng*
Affiliation:
Department of Mechanical Engineering, Louisiana State University, Baton Rouge, Louisiana 70803
G.B. Sinclair
Affiliation:
Department of Mechanical Engineering, Louisiana State University, Baton Rouge, Louisiana 70803
E. Lara-Curzio
Affiliation:
High Temperature Materials Laboratory, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Replication of metallic high-aspect-ratio microscale structures (HARMS) by compression molding has been demonstrated recently. Molding replication of metallic HARMS can potentially lead to low-cost fabrication of a wide variety of metal-based microdevices. Understanding the mechanics of metal micromolding is critical for assessing the capabilities and limitations of this replication technique. This paper presents results of instrumented micromolding of Al. Measured molding response was rationalized with companion high-temperature tensile testing of Al using a simple mechanics model of the micromolding process. The present results suggest that resisting pressure on the mold insert during micromolding is governed primarily by the yield stress of the molded metal at the molding temperature and a frictional traction on the sides of the insert. The influence of strain rate is also considered.

Keywords

ForgingMetalMicroelectro-mechanical (MEMS)
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 7 , July 2007 , pp. 1839 - 1848
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1Tuckerman, D.B. Pease, R.F.W.: High performance heat sinking for VLSI. IEEE Elect. Dev. Lett. 2, 126 1981CrossRefGoogle Scholar
2Busch-Vishniac, I.J.: The case for magnetically driven microactuators. Sens. Actuators, A 33, 207 1992CrossRefGoogle Scholar
3Arias, F., Oliver, S.R.J., Xu, B., Homlin, R.E. Whitesides, G.M.: Fabrication of metallic heat exchangers using sacrificial polymer mandrils. JMEMS 10, 107 2001Google Scholar
4Williams, J.D. Wang, W.: Microfabrication of an electromagnetic power relay using SU-8 based UV-LIGA technology. Microsystem Technol. 10, 699 2004CrossRefGoogle Scholar
5Becker, E.W., Ehrfeld, W., Munchmeyer, D., Betz, H., Heuberger, A., Pongratz, S., Glashauser, W., Michel, H.J. Siemens, V.R.: Production of separation-nozzle systems for uranium enrichment by a combination of x-ray-lithography and galvanoplastics. Naturwissenschaften 69, 520 1982CrossRefGoogle Scholar
6Madou, M.: Fundamentals of Microfabrication CRC Press, Boca Raton, FL 2000Google Scholar
7Heckele, M., Bacher, W. Muller, K.D.: Hot embossing—The molding technique for plastic microstructures. Microsystem Technol. 4, 122 1998CrossRefGoogle Scholar
8Cao, D.M., Meng, W.J. Kelly, K.W.: High-temperature instrumented microscale compression molding of Pb. Microsystem Technol. 10, 323 2004CrossRefGoogle Scholar
9Cao, D.M., Guidry, D., Meng, W.J. Kelly, K.W.: Molding of Pb and Zn with microscale mold inserts. Microsystem Technol. 9, 559 2003CrossRefGoogle Scholar
10Cao, D.M. Meng, W.J.: Microscale compression molding of Al with surface engineered LiGA inserts. Microsystem Technol. 10, 662 2004CrossRefGoogle Scholar
11Cao, D.M., Jiang, J., Meng, W.J., Jiang, J.C. Wang, W.: Fabrication of high-aspect-ratio microscale Ta mold inserts with micro-electrical-discharge-machining. Microsystem Technol. 13, 503 2007CrossRefGoogle Scholar
12Cao, D.M., Wang, T., Feng, B., Meng, W.J. Kelly, K.W.: Amorphous hydrocarbon based thin films for high-aspect-ratio MEMS applications. Thin Solid Films 398/399, 553 2001CrossRefGoogle Scholar
13Cao, D.M., Meng, W.J., Simko, S.J., Doll, G.L., Wang, T. Kelly, K.W.: Conformal deposition of Ti-C:H coatings over high-aspect-ratio micro-scale structures and tribological characteristics. Thin Solid Films 429, 46 2003CrossRefGoogle Scholar
14Cao, D.M., Jiang, J., Yang, R. Meng, W.J.: Fabrication of high-aspect-ratio microscale mold inserts by parallel μEDM. Microsystem Technol. 12, 839 2006CrossRefGoogle Scholar
15Meng, W.J., Cao, D.M. Sinclair, G.B.: Stresses during micromolding of metals at elevated temperatures: Pilot experiments and a simple model. J. Mater. Res. 20, 161 2005CrossRefGoogle Scholar
16ASM Metals Handbook 9th ed. ASM, Metals Park, OH 1979 Vol. 2, 799Google Scholar
17Cao, D.M., Jiang, J. Meng, W.J.: Metal micromolding with surface engineered inserts, in Surface Engineering for Manufacturing Applications, edited by S.J. Bull, P.R. Chalker, S-C. Chen, W.J. Meng, and R. Maboudian (Mater. Res. Soc. Symp. Proc. 890, Warrendale, PA, 2006), p. 99Google Scholar
18Tabor, D.: The Hardness of Metals Clarendon Press, Oxford, UK 1951Google Scholar
19Sinclair, G.B., Follansbee, P.S. Johnson, K.L.: Quasi-static normal indentation of an elasto-plastic half-space by a rigid sphere-II: Results. Int. J. Solids Struct. 21, 865 1985CrossRefGoogle Scholar
20Jiang, J., Sinclair, G.B. Meng, W.J.: Preliminary finite element analyses of the elasto-plastic response of substrates indented by periodic arrays of smooth strip punches, Report ME-MA2-06, Mechanical Engineering Department Louisiana State University, Baton Rouge, LA 2006Google Scholar
21ANSYS Advanced Analysis Techniques, Revision 10.0 ANSYS Inc., Cannonsburg, PA 2006Google Scholar
22Steuermann, I.Y.: Contact Problem of the Theory of Elasticity Gostekhteoretizdat, Moscow, U.S.S.R. 1949Google Scholar
23Weertman, J.: Theory of steady-state creep based on dislocation climb. J. Appl. Phys. 26(10), 1213 1955CrossRefGoogle Scholar
24Porter, D.A. Easterling, K.E.: Phase Transformations in Metals and Alloys 2nd ed. CRC Press, Boca Raton, FL 2004Google Scholar
25Weertman, J.: Creep of polycrystalline aluminum as determined from strain rate tests. J. Mech. Phys. Solids 4, 230 1956CrossRefGoogle Scholar
26Frost, H.J. Ashby, M.F.: Deformation Mechanism Maps, the Plasticity and Creep of Metals and Ceramics Pergamon Press, Oxford, UK 1982Google Scholar
27Nadai, A.: Theory of Flow and Fracture of Solids McGraw Hill, New York 1963Google Scholar