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Fracture strength measurement of filament assisted CVD polycrystalline diamond films

Published online by Cambridge University Press:  31 January 2011

G.F. Cardinale  and
C.J. Robinson
G.F. Cardinale*
Affiliation:
Raytheon Company, Research Division, Lexington, Massachusetts 02173
C.J. Robinson
Affiliation:
Raytheon Company, Research Division, Lexington, Massachusetts 02173
*
a)Present address: Department of Mechanical Engineering, University of California, Davis, California 95616.
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Abstract

The fracture strength of polycrystalline diamond films deposited by filament assisted chemical vapor deposition in the thickness range of 3.5 to 160 μm is investigated. Using a burst pressure technique, the fracture strengths of circular diamond film specimens are calculated. An average fracture strength of 730 MPa for nine samples was computed. This value is in good agreement with published strengths of microwave plasma deposited diamond films, comparable to other high strength materials, and within an order of magnitude of the fracture strength of bulk natural diamond. The average fracture strength of the fine-grained substrate interface appears consistently higher than that of the coarse-grained diamond growth surface.

Type
Articles
Information
Journal of Materials Research , Volume 7 , Issue 6 , June 1992 , pp. 1432 - 1437
Copyright
Copyright © Materials Research Society 1992

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