Hostname: page-component-586b7cd67f-r5fsc Total loading time: 0 Render date: 2024-11-20T07:28:33.108Z Has data issue: false hasContentIssue false

Fabrication of surface barrier layer capacitor on BaTiO3-based composite containing particulate SiC

Published online by Cambridge University Press:  31 January 2011

Hae Jin Hwang
Affiliation:
The Institute of Scientific and Industrial Research, Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka 567, Japan
Koichi Niihara
Affiliation:
The Institute of Scientific and Industrial Research, Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka 567, Japan
Get access

Abstract

Surface reoxidized-type barrier layer (BL) capacitors were prepared by hot-pressing BaTiO3/SiC powder mixture in argon atmosphere and subsequently oxidizing the semiconducting BaTiO3-based composites with fine SiC particles. Dielectric properties, such as apparent relative dielectric constant, dielectric loss tangent, and Curie temperature, were investigated as a function of SiC content and oxidation procedures. Incorporating SiC particles into BaTiO3 matrix, a thin surface insulating layer was formed, which becomes thinner by increasing the SiC content. BL capacitors showing a higher capacitance than 3 × 102 nF/cm2 could be successfully fabricated. The results were discussed on the basis of high resolution transmission electron microscope (HRTEM) studies. Thin oxidized layer and the resulting high capacitance were associated with the depression of oxygen diffusion due to the presence of intergranular SiC particles. The thickness of the surface layer and some dielectric properties could be controlled by the SiC content as well as oxidation temperature and time.

Type
Articles
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Glaister, R. M., U.S. Patent 3,028,248 (1962).Google Scholar
2.Waku, S., Uchida, M., and Kiuchi, K., Rev. E.C.L. 18, 681 (1970).Google Scholar
3.Waku, S., Nishimura, A., and Murakami, T., Rev. E.C.L. 19, 665 (1971).Google Scholar
4.Hwang, H. J., Sekino, T., Ota, K., and Niihara, K., J. Mater. Sci. 31, 4617 (1996).CrossRefGoogle Scholar
5.Hwang, H. J. and Niihara, K., Scripta Mat. et Mater. 36, 183 (1997).CrossRefGoogle Scholar
6.Hwang, H. J. and Niihara, K., J. Mater. Sci. 33, 5496 (1998).Google Scholar
7.Vaya, P. R., Majhi, J., Gapalam, B. S. V., and Dattatreyan, C., Phys. State Sol. A 87, 341 (1985).CrossRefGoogle Scholar
8.Coufova, P. and Arend, H., Czech. J. Phys. B11, 416 (1961).CrossRefGoogle Scholar
9.Saburi, O., J. Phys. Soc. Jpn. 14, 1159 (1959).CrossRefGoogle Scholar
10.Chan, N. H., Sharma, R. K., and Smyth, D. M., J. Am. Ceram. Soc. 64, 556 (1981).CrossRefGoogle Scholar
11.Chan, N. H. and Sharma, R. K., J. Electrochem. Soc. 128, 1762 (1981).CrossRefGoogle Scholar
12.Martirena, H. T. and Burfoot, J. C., J. Phys. C: Solid State Phys. 7, 3182 (1974).CrossRefGoogle Scholar
13.Kanata, T., Yoshikawa, T., and Kubota, K., Solid State Commun. 62, 765 (1987).CrossRefGoogle Scholar
14.Arlt, G., Hennings, D., and De With, G., J. Appl. Phys. 58, 1619 (1985).CrossRefGoogle Scholar
15.Shannon, R. D. and Prewitt, C. T., Acta Crystallogr. B25, 925 (1969).CrossRefGoogle Scholar
16.Mori, T. and Tanaka, K., Acta Metall. 21, 571 (1973).CrossRefGoogle Scholar
17.Forsbergh, P. W., Jr., Phys. Rev. 93, 686 (1954).CrossRefGoogle Scholar
18.Samara, G. A., Phys. Rev. 150, 378 (1966).CrossRefGoogle Scholar