Hostname: page-component-586b7cd67f-g8jcs Total loading time: 0 Render date: 2024-11-26T22:36:56.009Z Has data issue: false hasContentIssue false
  • English
  • Français

Enhanced stress relaxation of Sn–3.8Ag–0.7Cu solder by electrical current

Published online by Cambridge University Press:  31 January 2011

Haiyan Liu ,
Qingsheng Zhu ,
Li Zhang ,
Zhongguang Wang  and
Jian Ku Shang
Zhongguang Wang
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Jian Ku Shang*
Affiliation:
Department of Materials Science and Engineering, University of Illinois at Urbana–Champaign, Urbana, Illinois 61801
*
b)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

The stress relaxation responses of the Sn–3.8Ag–0.7Cu joints following exposure to electrical currents were examined to investigate the effect of electromigration on the reliability of solder joints. It was found that the stress relaxation rate was enhanced for the Sn–3.8Ag–0.7Cu solder joints subjected to a current density of 2 × 104 A/cm2. Sn hillock formation was observed in situ on the surface of the solder joint and the increase of the hillock volume was obtained as a function of the current application time. Analysis of the vacancy flux indicated that the variations of the vacancy concentration with the electromigration time from the calculations agreed with the growth kinetics of the hillocks observed in the experiments. By modeling the stress relaxation as a climb-assisted dislocation glide process, it is shown that the vacancy accumulation induced by electromigration enhanced the dislocation climb rate, resulting in a large increase of the stress relaxation rate.

Keywords

ElectromigrationSoldering
Type
Articles
Information
Journal of Materials Research , Volume 25 , Issue 6 , June 2010 , pp. 1172 - 1178
Copyright
Copyright © Materials Research Society 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Yamanaka, K., Tsukada, Y., Suganuma, K.Electromigration effect on solder bump in Cu/Sn–3Ag–0.5Cu/Cu system. Scr. Mater. 55, 867 (2006)CrossRefGoogle Scholar
2.Chao, B., Chae, S.H., Zhang, X., Lu, K.H., Im, J., Ho, P.S.Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing. Acta Mater. 55, 2805 (2007)CrossRefGoogle Scholar
3.Wu, A.T., Tu, K.N., Lloyd, J.R., Tamura, N., Valek, B.C., Kao, C.R.Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction. Appl. Phys. Lett. 85, 2490 (2004)CrossRefGoogle Scholar
4.Chen, C.M., Hung, Y.M., Lin, C.H.Electromigration of Sn–8 wt% Zn–3 wt% Bi and Sn–9 wt% Zn–1 wt% Cu solders. J. Alloys Compd. 475, 238 (2009)CrossRefGoogle Scholar
5.Jadhav, S.G., Bieler, T.R., Subramanian, K.N., Lucas, J.P.Stress relaxation behavior of composite and eutectic Sn–Ag solder joints. J. Electron. Mater. 30, 1197 (2001)CrossRefGoogle Scholar
6.Daghfal, J.P., Shang, J.K.Current-induced phase partitioning in eutectic indium-tin Pb-free solder interconnect. J. Electron. Mater. 36, 1372 (2007)CrossRefGoogle Scholar
7.Nah, J.W., Paik, K.W., Suh, J.O., Tu, K.N.Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints. J. Appl. Phys. 94, 7560 (2003)CrossRefGoogle Scholar
8.Lin, Y.H., Hu, Y.C., Tsai, C.M., Kao, C.R., Tu, K.N.In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing. Acta Mater. 53, 2029 (2005)CrossRefGoogle Scholar
9.Ren, F., Nah, J.W., Tu, K.N.Electromigration induced ductile-to-brittle transition in lead-free solder joints. Appl. Phys. Lett. 89, 141914 (2006)CrossRefGoogle Scholar
10.Nah, J.W., Ren, F., Paik, K.W., Tu, K.N.Effect of electromigration on mechanical shear behavior of flip chip solder joints. J. Mater. Res. 21, 698 (2006)CrossRefGoogle Scholar
11.Zhang, J.S., Chan, Y.C., Wu, Y.P., Xi, H.J., Wu, F.S.Electromigration of Pb-free solder under a low level of current density. J. Alloys Compd. 458, 492 (2008)CrossRefGoogle Scholar
12.Lu, C.C., Wang, S.J., Liu, C.Y.Electromigration studies on Sn(Cu) alloy lines. J. Electron. Mater. 32, 1515 (2003)CrossRefGoogle Scholar
13.Zeng, K., Tu, K.N.Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng., R 38, 55 (2002)CrossRefGoogle Scholar
14.Kerr, M., Chawla, N.Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales. Acta Mater. 52, 4527 (2004)CrossRefGoogle Scholar
15.Wiese, S., Wolter, K.J.Creep of thermally aged SnAgCu-solder joints. Microelectron. Reliab. 44, 223 (2004)Google Scholar
16.Wu, C.M.L., Huang, M.L.Creep behavior of eutectic Sn–Cu lead-free solder alloy. J. Electron. Mater. 31, 442 (2002)CrossRefGoogle Scholar
17.Mahmudi, R., Bazzaz, A.R., Fard, H.R.B.Investigation of stress exponent in the room-temperature creep of Sn–40Pb–2.5Sb solder alloy. J. Alloys Compd. 429, 192 (2007)CrossRefGoogle Scholar
18.Igoshev, V.I., Kleiman, J.I.Creep phenomena in lead-free solders. J. Electron. Mater. 29, 244 (2000)CrossRefGoogle Scholar
19.Ochoa, F., Deng, X., Chawla, N.Effects of cooling rate on creep behavior of a Sn–3.5Ag alloy. J. Electron. Mater. 33, 1596 (2004)CrossRefGoogle Scholar
20.Fujiwara, M., Otsuka, M.Indentation creep of beta Sn and Sn–Pb eutectic alloy. Mater. Sci. Eng., A 319–321, 929 (2001)CrossRefGoogle Scholar
21.Mathew, M.D., Yang, H., Movva, S., Murty, K.L.Creep deformation characteristics of tin and tin-based electronic solder alloys. Metall. Mater. Trans. A 36, 99 (2005)CrossRefGoogle Scholar
22.Yu, Y.N., Mao, W.M.The properties of dislocationStructure of Material edited by W. Zhang and L. Mei (Mechanical Industry Press, Beijing 2001)Google Scholar
23.Yu, Y.N., Mao, W.M.Dislocation climbStructure of Material edited by W. Zhang and L. Mei (Mechanical Industry Press, Beijing 2001)Google Scholar
24.Clement, J.J.Vacancy supersaturation model for electromigration failure under dc and pulsed dc stress. J. Appl. Phys. 71, 4264 (1999)CrossRefGoogle Scholar
25.Basaran, C., Lin, M.Damage mechanics of electromigration induced failure. Mech. Mater. 40, 66 (2008)CrossRefGoogle Scholar
26.Courtney, T.H.High-temperature deformation of crystalline materialsMechanical Behavior of Materials edited by Z.F. Zhang (Metallurgical Industry Press, Beijing 2004)Google Scholar