Hostname: page-component-586b7cd67f-dsjbd Total loading time: 0 Render date: 2024-11-22T22:09:27.072Z Has data issue: false hasContentIssue false
  • English
  • Français

Electron backscattered diffraction analysis of the effect of deformation temperature on the microstructure evolution in a typical nickel-based superalloy during hot deformation

Published online by Cambridge University Press:  25 April 2016

Shengxue Qin ,
Hongbin Zhang ,
Jie Liu  and
Wei Zheng
Shengxue Qin
Affiliation:
College of Mechanical and Electronic Engineering, Shandong University of Science and Technology, Qingdao 266590, People's Republic of China
Hongbin Zhang*
Affiliation:
College of Mechanical and Electronic Engineering, Shandong University of Science and Technology, Qingdao 266590, People's Republic of China
Jie Liu*
Affiliation:
College of Mechanical and Electronic Engineering, Shandong University of Science and Technology, Qingdao 266590, People's Republic of China
Wei Zheng
Affiliation:
School of Materials Science and Engineering, Shandong Jianzhu University, Jinan 250101, People's Republic of China
*
a) Address all correspondence to these authors. e-mail: [email protected]
b) e-mail: [email protected]
Get access

Abstract

The microstructure evolution of a typical nickel-based superalloy was studied in the temperature range of 960–1160 °C with the strain rate of 0.001 s−1 by using electron backscattered diffraction technique. Based on the grain orientation spread method, the dynamic recrystallization (DRX) grains were distinguished from the deformed grains. The results revealed that the volume fraction and the size of DRX grains increased with the increasing deformation temperatures. Most of the original Σ3 boundaries lost their twin characteristics due to crystal rotations during hot deformation. Meanwhile, lots of new Σ3 boundaries were formed in the DRX grains mainly by growth accidents. Moreover, the deformation temperature had a similar effect on the fraction of Σ3 boundary and the Σ3 boundary density in the DRX domains, which increased firstly and then decreased with the increasing deformation temperature. The Σ3 boundary density was analyzed as a function of grain size, and the critical grain size below which no twin forms was calculated to be 2.06 µm. In addition, the coherent Σ3 boundaries were easier to form at the higher deformation temperature due to their lower boundary energy.

Keywords

nickel-based superalloyEBSDdynamic recrystallizationΣ3 boundary
Type
Articles
Information
Journal of Materials Research , Volume 31 , Issue 9 , 14 May 2016 , pp. 1348 - 1360
Copyright
Copyright © Materials Research Society 2016 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Zhang, H., Zhang, K., Lu, Z., Zhao, C., and Yang, X.: Hot deformation behavior and processing map of a γ′-hardened nickel-based superalloy. Mater. Sci. Eng., A 604, 1 (2014).Google Scholar
Zhang, P., Zhu, Q., Hu, C., Wang, C.-j., Chen, G., and Qin, H.-y.: Cyclic deformation behavior of a nickel-base superalloy under fatigue loading. Mater. Des. 69, 12 (2015).Google Scholar
Zhang, P., Hu, C., Ding, C.-g., Zhu, Q., and Qin, H.-y.: Plastic deformation behavior and processing maps of a Ni-based superalloy. Mater. Des. 65, 575 (2015).CrossRefGoogle Scholar
Wang, X., Brünger, E., and Gottstein, G.: The role of twinning during dynamic recrystallization in alloy 800H. Scr. Mater. 46(12), 875 (2002).Google Scholar
Zhang, H., Zhang, K., Zhou, H., Lu, Z., Zhao, C., and Yang, X.: Effect of strain rate on microstructure evolution of a nickel-based superalloy during hot deformation. Mater. Des. 80, 51 (2015).CrossRefGoogle Scholar
Randle, V. and Brown, A.: Development of grain misorientation texture, in terms of coincident site lattice structures, as a function of thermomechanical treatments. Philos. Mag. A 59(5), 1075 (1989).Google Scholar
Gottstein, G. and Kocks, U.: Dynamic recrystallization and dynamic recovery in 〈111〉 single crystals of nickel and copper. Acta Metall. 31(1), 175 (1983).Google Scholar
Tan, L. and Allen, T.: An electron backscattered diffraction study of grain boundary-engineered INCOLOY alloy 800H. Metall. Mater. Trans. A 36(7), 1921 (2005).CrossRefGoogle Scholar
Lehockey, E., Brennenstuhl, A., and Thompson, I.: On the relationship between grain boundary connectivity, coincident site lattice boundaries, and intergranular stress corrosion cracking. Corros. Sci. 46(10), 2383 (2004).Google Scholar
Aust, K., Erb, U., and Palumbo, G.: Interface control for resistance to intergranular cracking. Mater. Sci. Eng., A 176(1), 329 (1994).Google Scholar
Lin, P., Palumbo, G., Erb, U., and Aust, K.: Influence of grain boundary character distribution on sensitization and intergranular corrosion of alloy 600. Scr. Metall. Mater. 33(9), 1387 (1995).CrossRefGoogle Scholar
Randle, V.: The Role of the Coincidence Site Lattice in Grain Boundary Engineering (Maney Pub, London, 1996).Google Scholar
Randle, V.: Mechanism of twinning-induced grain boundary engineering in low stacking-fault energy materials. Acta Mater. 47(15), 4187 (1999).CrossRefGoogle Scholar
Randle, V.: Twinning-related grain boundary engineering. Acta Mater. 52(14), 4067 (2004).Google Scholar
Brandon, D.: The structure of high-angle grain boundaries. Acta Metall. 14(11), 1479 (1966).CrossRefGoogle Scholar
Sun, H.-y., Zhou, Z.-j., Man, W., and Xiao, L.: Effect of thermomechanical parameters on Σ3 n grain boundaries and grain boundary networks of a new superaustenitic stainless steel. J. Iron Steel Res. Int. 21(1), 109 (2014).Google Scholar
Cao, Y., Di, H., Misra, R., Yi, X., Zhang, J., and Ma, T.: On the hot deformation behavior of AISI 420 stainless steel based on constitutive analysis and CSL model. Mater. Sci. Eng., A 593, 111 (2014).Google Scholar
Song, K.-H., Chun, Y., and Hwang, S.-K.: Direct observation of annealing twin formation in a Pb-base alloy. Mater. Sci. Eng., A 454, 629 (2007).Google Scholar
Wang, Y., Shao, W., Zhen, L., and Zhang, X.: Microstructure evolution during dynamic recrystallization of hot deformed superalloy 718. Mater. Sci. Eng., A 486(1), 321 (2008).Google Scholar
Cao, Y., Di, H., Zhang, J., Zhang, J., Ma, T., and Misra, R.: An electron backscattered diffraction study on the dynamic recrystallization behavior of a nickel–chromium alloy (800H) during hot deformation. Mater. Sci. Eng., A 585, 71 (2013).Google Scholar
Mitsche, S., Sommitsch, C., Huber, D., Stockinger, M., and Poelt, P.: Assessment of dynamic softening mechanisms in Allvac® 718Plus™ by EBSD analysis. Mater. Sci. Eng., A 528(10), 3754 (2011).Google Scholar
Tan, L., Sridharan, K., and Allen, T.R.: Effect of thermomechanical processing on grain boundary character distribution of a Ni-based superalloy. J. Nucl. Mater. 371(1–3), 171 (2007).Google Scholar
Yamaura, S., Igarashi, Y., Tsurekawa, S., and Watanabe, T.: Structure-dependent intergranular oxidation in Ni–Fe polycrystalline alloy. Acta Mater. 47(4), 1163 (1999).Google Scholar
Fullman, R.L. and Fisher, J.C.: Formation of annealing twins during grain growth. J. Appl. Phys. 22(11), 1350 (1951).Google Scholar
Mandal, S., Bhaduri, A., and Sarma, V.S.: Studies on twinning and grain boundary character distribution during anomalous grain growth in a Ti-modified austenitic stainless steel. Mater. Sci. Eng., A 515(1), 134 (2009).Google Scholar
Randle, V.: The influence of annealing twinning on microstructure evolution. J. Mater. Sci. 40(4), 853 (2005).Google Scholar
Randle, V. and Davies, P.: Deviation from reference planes and reference misorientation for Σ3 boundaries. Interface Sci. 7(1), 5 (1999).CrossRefGoogle Scholar
Doherty, R., Hughes, D., Humphreys, F., Jonas, J., Jensen, D.J., Kassner, M., King, W., McNelley, T., McQueen, H., and Rollett, A.: Current issues in recrystallization: a review. Mater. Sci. Eng., A 238(2), 219 (1997).Google Scholar
Guo, Q., Li, D., Guo, S., Peng, H., and Hu, J.: The effect of deformation temperature on the microstructure evolution of Inconel 625 superalloy. J. Nucl. Mater. 414(3), 440 (2011).Google Scholar
Rollett, A., Humphreys, F., Rohrer, G.S., and Hatherly, M.: Recrystallization and Related Annealing Phenomena (Elsevier, Amsterdam, 2004).Google Scholar
Chen, X.-M., Lin, Y., Wen, D.-X., Zhang, J.-L., and He, M.: Dynamic recrystallization behavior of a typical nickel-based superalloy during hot deformation. Mater. Des. 57, 568 (2014).Google Scholar
Field, D., Bradford, L., Nowell, M., and Lillo, T.: The role of annealing twins during recrystallization of Cu. Acta Mater. 55(12), 4233 (2007).Google Scholar
Imbert, C. and McQueen, H.: Dynamic recrystallization of A2 and M2 tool steels. Mater. Sci. Eng., A 313(1), 104 (2001).Google Scholar
Li, D., Guo, Q., Guo, S., Peng, H., and Wu, Z.: The microstructure evolution and nucleation mechanisms of dynamic recrystallization in hot-deformed Inconel 625 superalloy. Mater. Des. 32(2), 696 (2011).Google Scholar
Humphreys, F.J. and Hatherly, M.: Hot Deformation and Dynamic Restoration, In Recrystallization & Related Annealing Phenomena, Vol. 415 (Elsevier, Amsterdam, 2004).Google Scholar
Wusatowska-Sarnek, A., Miura, H., and Sakai, T.: Nucleation and microtexture development under dynamic recrystallization of copper. Mater. Sci. Eng., A 323(1), 177 (2002).Google Scholar
Zhang, H., Zhang, K., Jiang, S., Zhou, H., Zhao, C., and Yang, X.: Dynamic recrystallization behavior of a γ′-hardened nickel-based superalloy during hot deformation. J. Alloys Compd. 623, 374 (2015).Google Scholar
Zong, Y., Shan, D., Lü, Y., and Guo, B.: Effect of 0.3 wt% H addition on the high temperature deformation behaviors of Ti–6Al–4V alloy. Int. J. Hydrogen Energy 32(16), 3936 (2007).Google Scholar
Sample, V., Fitzsimons, G., and DeArdo, A.: Dynamic softening of copper during deformation at high temperatures and strain rates. Acta Metall. 35(2), 367 (1987).Google Scholar
Mahajan, S., Pande, C., Imam, M., and Rath, B.: Formation of annealing twins in fcc crystals. Acta Mater. 45(6), 2633 (1997).Google Scholar
Wang, Y., Shao, W., Zhen, L., Yang, L., and Zhang, X.: Flow behavior and microstructures of superalloy 718 during high temperature deformation. Mater. Sci. Eng., A 497(1), 479 (2008).Google Scholar
Li, Z., Zhang, L., Sun, N., Sun, Y., and Shan, A.: Effects of prior deformation and annealing process on microstructure and annealing twin density in a nickel based alloy. Mater. Charact. 95, 299 (2014).CrossRefGoogle Scholar
Mandal, S., Bhaduri, A., and Sarma, V.S.: Role of twinning on dynamic recrystallization and microstructure during moderate to high strain rate hot deformation of a Ti-modified austenitic stainless steel. Metall. Mater. Trans. A 43(6), 2056 (2012).Google Scholar
Olmsted, D.L., Foiles, S.M., and Holm, E.A.: Survey of computed grain boundary properties in face-centered cubic metals: I. Grain boundary energy. Acta Mater. 57(13), 3694 (2009).Google Scholar
Horton, D., Thomson, C., and Randle, V.: Aspects of twinning and grain growth in high purity and commercially pure nickel. Mater. Sci. Eng., A 203(1), 408 (1995).CrossRefGoogle Scholar
Sutton, A.P. and Balluffi, R.W.: Interfaces in crystalline materials. (Clarendon Press, Oxford, 1995).Google Scholar
Rohrer, G.S.: Grain boundary energy anisotropy: a review. J. Mater. Sci. 46(18), 5881 (2011).Google Scholar
Wolf, D. and Jaszczak, J.: Materials interfaces: Atomic-level structure and properties. (1992).Google Scholar
Mandal, S., Jayalakshmi, M., Bhaduri, A., and Sarma, V.S.: Effect of strain rate on the dynamic recrystallization behavior in a nitrogen-enhanced 316L (N). Metall. Mater. Trans. A 45(12), 5645 (2014).Google Scholar
Jin, Y., Bernacki, M., Rohrer, G.S., Rollett, A.D., Lin, B., and Bozzolo, N.: Formation of annealing twins during recrystallization and grain growth in 304L austenitic stainless steel. In Materials Science Forum, Vol. 753 (Trans Tech Publications, Zurich, 2013); pp. 113.Google Scholar
Pande, C., Imam, M., and Rath, B.: Study of annealing twins in fcc metals and alloys. Metall. Trans. A 21(11), 2891 (1990).CrossRefGoogle Scholar
Booth, M., Randle, V., and Owen, G.: Time evolution of sigma 3 annealing twins in secondary recrystallized nickel. J. Microsc. 217(2), 162 (2005).Google Scholar
Bozzolo, N., Souaï, N., and Logé, R.E.: Evolution of microstructure and twin density during thermomechanical processing in a γ-γ’nickel-based superalloy. Acta Mater. 60(13), 5056 (2012).CrossRefGoogle Scholar
Jin, Y., Lin, B., Bernacki, M., Rohrer, G.S., Rollett, A., and Bozzolo, N.: Annealing twin development during recrystallization and grain growth in pure nickel. Mater. Sci. Eng., A 597, 295 (2014).CrossRefGoogle Scholar