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Effects of Properties and Growth Parameters of Doped and Undoped Silicon Oxide Films on Wear Behavior During Chemical Mechanical Planarization Process

Published online by Cambridge University Press:  03 March 2011

A.K. Sikder ,
Ashok Kumar ,
S. Thagella  and
Jiro Yota
A.K. Sikder
Affiliation:
Nanomaterials and Nanomanufacturing Research Center, University of South Florida, Tampa, Florida 33620
Ashok Kumar*
Affiliation:
Nanomaterials and Nanomanufacturing Research Center, and Department of Mechanical Engineering, University of South Florida, Tampa, Florida 33620
S. Thagella
Affiliation:
Nanomaterials and Nanomanufacturing Research Center, and Department of Industrial Engineering, University of South Florida, Tampa, Florida 33620
Jiro Yota
Affiliation:
Advanced Process Technology, Skyworks Solutions, Inc., Newbury Park, California 91320
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Understanding the tribological, mechanical, and structural properties of an inorganic and organic dielectric layer in the chemical mechanical planarization (CMP) process is crucial for successful evaluation and implementation of these materials with copper metallization. Polishing behaviors of different carbon- and fluorine-doped silicon dioxide (SiO2) low dielectric constant materials in CMP process are discussed in this paper. Films were deposited using both chemical vapor deposition and spin-on method. Carbon and fluorine incorporation in the Si–O network weaken the mechanical integrity of the structure and behave differently in slurry selective to SiO2 films. Mechanical properties of the films were measured using depth-sensing nanoindentation technique, and it was found that undoped SiO2 film has the highest and spin-on carbon-doped oxide films have the lowest hardness and modulus values. Wear behavior of the doped SiO2 is studied in a typical SiO2 CMP environment, and results are analyzed and compared with those of the undoped SiO2 films. Coefficient of friction and acoustic emission signals have significant effect on the polishing behavior. Surface of the films are investigated before and after polishing using atomic force microscopy. Roughness and section analysis of the films after polishing show the variation in wear mechanism. Validation of Preston’s equation is discussed in this study. Additionally, different wear mechanisms are presented, and a two body abrasion model is proposed for the softer films.

Keywords

CMPNanoindentationWear
Type
Articles
Information
Journal of Materials Research , Volume 19 , Issue 4 , April 2004 , pp. 996 - 1010
Copyright
Copyright © Materials Research Society 2004

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