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Effects of plasma power on the properties of low-k polymerlike organic thin films deposited by plasma-enhanced chemical vapor deposition using the toluene precursor

Published online by Cambridge University Press:  31 January 2011

Jongryang Joo ,
Yong Chun Quan  and
Donggeun Jung
Jongryang Joo
Affiliation:
Department of Physics, Institute of Basic Science, and Department of Vacuum Science and Engineering, Sungkyunkwan University, Suwon 440-746, Korea
Yong Chun Quan
Affiliation:
Department of Physics and Institute of Basic Science, Sungkyunkwan University, Suwon 440-746, Korea
Donggeun Jung
Affiliation:
Department of Physics and Institute of Basic Science, Sungkyunkwan University, Suwon 440-746, Korea
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Extract

Effects of plasma power on the properties of polymerlike organic thin films deposited by plasma-enhanced chemical vapor deposition using the toluene precursor were studied. As the plasma power was increased from 5 to 60 W, the relative dielectric constant increased from 2.53 to 2.85. The film deposited at higher plasma power showed higher thermal stability. The film deposited at 60 W was stable up to 400 °C. All the films were insulating under applied field ≤1 MV/cm.

Type
Articles
Information
Journal of Materials Research , Volume 15 , Issue 1 , January 2000 , pp. 228 - 230
Copyright
Copyright © Materials Research Society 2000

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References

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