Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Yu, Jin
and
Kim, J.Y.
2008.
Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder joints.
Acta Materialia,
Vol. 56,
Issue. 19,
p.
5514.
Young-Kun Jee
Yang-hua Xia
Jin Yu
Hyun-Woo Kang
and
Taek-Young Lee
2008.
Effect of Al addition in Sn-Ag solder on the interfacial reactions with Cu and ENIG metallizations.
p.
491.
Jee, Y. K.
Yu, J.
Park, K. W.
and
Oh, T. S.
2009.
Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package.
Journal of Electronic Materials,
Vol. 38,
Issue. 5,
p.
685.
Kim, J.Y.
Yu, Jin
and
Kim, S.H.
2009.
Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn–3.5Ag solder joints.
Acta Materialia,
Vol. 57,
Issue. 17,
p.
5001.
Zhu, Q. S.
Song, H. Y.
Liu, H. Y.
Wang, Z. G.
and
Shang, J. K.
2009.
Effect of Zn addition on microstructure of Sn-Bi joint.
p.
1043.
Zhang, X.F.
Guo, J.D.
and
Shang, J.K.
2009.
Controlling intermetallic compound formation reaction between Sn and Ni–P by Zn addition.
Journal of Alloys and Compounds,
Vol. 479,
Issue. 1-2,
p.
505.
Kim, Young Min
Oh, Chang-Yul
Roh, Hee-Ra
and
Kim, Young-Ho
2009.
A new Cu-Zn solder wetting layer for improved impact reliability.
p.
1008.
Oh, Chang Yul
Roh, Hee-Ra
Kim, Young Min
Lee, Jin Soo
Cho, Hae Young
and
Kim, Young-Ho
2009.
A new solder wetting layer for Pb-free solders.
Journal of Materials Research,
Vol. 24,
Issue. 2,
p.
297.
Kotadia, H.R.
Mokhtari, O.
Bottrill, M.
Clode, M. P.
Green, M. A.
and
Mannan, S. H.
2010.
Effect of Al and Zn alloying elements on Sn-3.8Ag-0.7Cu and Sn-3.6Ag solder reaction with Cu and Ni(P) substrate.
p.
17.
Sihan Liu
Fang Liu
Zhe Li
Guangchen Xu
and
Guo, Fu
2010.
Effects of Joule heating on the impact behavior of lead-free Sn-based solder joints.
p.
652.
Kim, S.H.
and
Yu, Jin
2010.
Secondary IMC formation induced by Kirkendall voiding in Cu/Sn–3.5Ag solder joints.
Journal of Materials Research,
Vol. 25,
Issue. 9,
p.
1854.
Wang, Y. W.
Chang, C. C.
Chen, W. M.
and
Kao, C. R.
2010.
Effects of Ni Additions on the Growth of Cu3Sn in High-Lead Solders.
Journal of Electronic Materials,
Vol. 39,
Issue. 12,
p.
2636.
Kim, Sunghwan
and
Yu, Jin
2010.
Effects of Ag on the Kirkendall void formation of Sn–xAg/Cu solder joints.
Journal of Applied Physics,
Vol. 108,
Issue. 8,
Kotadia, H. R.
Mokhtari, O.
Bottrill, M.
Clode, M. P.
Green, M. A.
and
Mannan, S. H.
2010.
Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates.
Journal of Electronic Materials,
Vol. 39,
Issue. 12,
p.
2720.
Jee, Y. K.
and
Yu, Jin
2010.
Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM.
Journal of Electronic Materials,
Vol. 39,
Issue. 10,
p.
2286.
Kim, Young Min
Roh, Hee-Ra
Kim, Sungtae
and
Kim, Young-Ho
2010.
Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates.
Journal of Electronic Materials,
Vol. 39,
Issue. 12,
p.
2504.
Yu, Chi-Yang
Wang, Kai-Jheng
and
Duh, Jenq-Gong
2010.
Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging.
Journal of Electronic Materials,
Vol. 39,
Issue. 2,
p.
230.
Jang, Dong Min
and
Yu, Jin
2011.
Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy.
Journal of Materials Research,
Vol. 26,
Issue. 24,
p.
3032.
Liu, Lijuan
Zhou, Wei
Mu, Wenkai
and
Wu, Ping
2011.
Interfacial Reactions of Sn-3.5Ag-xZn Solders and Cu Substrate During Liquid-State Aging.
Journal of Electronic Materials,
Vol. 40,
Issue. 3,
p.
306.
Leong, Yee Mei
and
Haseeb, A.S.M.A.
2012.
Soldering and interfacial characteristics of Sn-3.5Ag solder containing zinc nanoparticles.
p.
1.