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Effect of pulse current on structure and adhesion of apatite electrochemically deposited onto titanium substrates

Published online by Cambridge University Press:  31 January 2011

Tomoyasu Hayakawa ,
Masakazu Kawashita ,
Gikan H. Takaoka  and
Toshiki Miyazaki
Tomoyasu Hayakawa
Affiliation:
Photonics and Electronics Science and Engineering Center, Graduate School of Engineering, Kyoto University, Nishikyo-ku, Kyoto 615-8510, Japan
Masakazu Kawashita*
Affiliation:
Center for Research Strategy and Support, Tohoku University, Aoba-ku, Sendai 980-8579, Japan
Gikan H. Takaoka
Affiliation:
Photonics and Electronics Science and Engineering Center, Graduate School of Engineering, Kyoto University, Nishikyo-ku, Kyoto 615-8510, Japan
Toshiki Miyazaki
Affiliation:
Graduate School of Life Science and Systems Engineering, Kyushu Institute of Technology, Wakamatsu-ku, Kitakyushu 808-0196, Japan
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Apatite films were deposited onto titanium (Ti) metal substrates by an electrodeposition method under a pulse current. Metastable calcium phosphate solution was used as the electrolyte. The ion concentration of the solution was 1.5 times that of human body fluid, but the solution did not contain magnesium ions at 36.5 °C. We used an average current density of 0.01 A/cm2 and current-on time (TON) equal to current-off time (TOFF) of 10 ms, 100 ms, 1 s, and 15 s. The adhesive strength between apatite and Ti substrates were relatively high at TON = TOFF = 10 ms. It is considered that small calcium phosphate (C–P) crystals with low crystallinity were deposited on the Ti surface without reacting with other C–P crystals, H2O, and HCO3− in the surrounding environment. This resulted in relaxation of the lattice mismatch and enhancement of the adhesive strength between the apatite crystals and Ti substrates.

Keywords

AdhesionElectrodepositionTi
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 12: Biomimetic and Bio-enabled Materials Science and Engineering , December 2008 , pp. 3176 - 3183
Copyright
Copyright © Materials Research Society 2008

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