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The effect of polymer hardness, pore size, and porosity on the performance of thermoplastic polyurethane-based chemical mechanical polishing pads

Published online by Cambridge University Press:  03 July 2013

Abaneshwar Prasad ,
George Fotou  and
Shoutian Li
Abaneshwar Prasad*
Affiliation:
Cabot Microelectronics Corporation, 870 North Commons Drive, Aurora, Illinois 605404
George Fotou*
Affiliation:
Cabot Microelectronics Corporation, 870 North Commons Drive, Aurora, Illinois 605404
Shoutian Li
Affiliation:
Cabot Microelectronics Corporation, 870 North Commons Drive, Aurora, Illinois 605404
*
a)Address all correspondence to these author. e-mail: [email protected]
b)e-mail: [email protected]
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Abstract

Solid-state microcellular foaming (SSMF) process was used to produce porous chemical mechanical polishing (CMP) pads in a variety of pore size and porosity range, using a variety of thermoplastic polyurethane (TPU) resin hardness. By controlling the pore size, porosity, and pad hardness, one is able to manufacture CMP pads that offer tunable pad properties. A brief introduction to the SSMF manufacturing process and thereby, unique microstructures created is first addressed followed by inner layer dielectric (ILD) CMP results, describing the effects of top TPU foam sheet properties, such as hardness, pore size, and porosity on ILD removal rate (RR) and wafer defects. Softer TPU-based porous pads showed significantly lower wafer scratch counts, while only a moderate increase in the ILD RR was seen with increasing resin hardness for similar pore size and porosity pads. Pore size has insignificant influence on wafer defect count but has significant influence on the ILD RR profile. CMP pads made from small pore size foams cause a nonflat RR profile.

Keywords

CMPfoamporosity
Type
Invited Papers
Information
Journal of Materials Research , Volume 28 , Issue 17: Focus Issue: Advances in the Synthesis, Characterization, and Properties of Bulk Porous Materials , 14 September 2013 , pp. 2380 - 2393
Copyright
Copyright © Materials Research Society 2013 

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