Hostname: page-component-78c5997874-8bhkd Total loading time: 0 Render date: 2024-11-04T21:39:51.695Z Has data issue: false hasContentIssue false

Effect of liquid structural transition on the dissolution of solid copper in liquid eutectic tin–bismuth

Published online by Cambridge University Press:  05 April 2016

Guo-Hua Ding*
Affiliation:
School of Physics and Electronic Information, Huaibei Normal University, Huaibei City, Anhui 235000, China; and Collaborative Innovation Center of Advanced Functional Materials of Anhui Province, Huaibei City, Anhui 235000, China
Xuan Qi
Affiliation:
School of Physics and Electronic Information, Huaibei Normal University, Huaibei City, Anhui 235000, China; and Collaborative Innovation Center of Advanced Functional Materials of Anhui Province, Huaibei City, Anhui 235000, China
Shu-Long Liu
Affiliation:
School of Physics and Electronic Information, Huaibei Normal University, Huaibei City, Anhui 235000, China; and Collaborative Innovation Center of Advanced Functional Materials of Anhui Province, Huaibei City, Anhui 235000, China
Ming Li
Affiliation:
School of Physics and Electronic Information, Huaibei Normal University, Huaibei City, Anhui 235000, China; and Collaborative Innovation Center of Advanced Functional Materials of Anhui Province, Huaibei City, Anhui 235000, China
Jing Hu
Affiliation:
School of Physics and Electronic Information, Huaibei Normal University, Huaibei City, Anhui 235000, China; and Collaborative Innovation Center of Advanced Functional Materials of Anhui Province, Huaibei City, Anhui 235000, China
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

The tin–bismuth eutectic alloy possesses anomalous physicochemical properties that are dependent on temperature. This paper reports the interfacial reaction and growth behavior of the intermetallic compound (IMC) layer during the dissolution of solid copper in liquid eutectic tin–bismuth at 673–823 K under the influence of the structural transition of liquid eutectic tin–bismuth. The structural transition markedly affected the dissolution rate constant of solid copper and the growth rate of the IMCs. Correspondingly, the application of the liquid structural transition significantly decreased the activation energy of dissolution and increased the apparent activation energy for IMC growth. Moreover, two major roles of elemental Bi on the formation and growth of the IMCs were suggested.

Type
Articles
Copyright
Copyright © Materials Research Society 2016 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Howes, M.A.H. and Saperstein, Z.P.: Reaction of lead–tin solders with copper alloys. Weld. J. 48(2), 80s (1969).Google Scholar
Glosli, J.N. and Ree, F.H.: Liquid–liquid phase transformation in carbon. Phys. Rev. Lett. 82, 4569 (1999).CrossRefGoogle Scholar
Katayama, Y., Mizutani, T., Utsumi, W., Shimomura, O., Yamakata, M., and Funakoshi, K.: A first-order liquid–liquid phase transition in phosphorus. Nature 403, 170 (2000).CrossRefGoogle ScholarPubMed
McMillan, P.: Phase transitions: Jumping between liquid states. Nature 403, 151 (2000).CrossRefGoogle ScholarPubMed
Bian, X.F. and Wang, W.M.: Thermal-rate treatment and structure transformation of Al–13 wt% Si alloy melt. Mater. Lett. 44, 54 (2000).CrossRefGoogle Scholar
Qin, Q.D., Zhao, Y.G., Liang, Y.H., and Zhou, W.: Effects of melt superheating treatment on microstructure of Mg2Si/Al–Si–Cu composite. J. Alloys Compd. 399, 106 (2005).CrossRefGoogle Scholar
Xu, C.L. and Jiang, Q.C.: Morphologies of primary silicon in hypereutectic Al–Si alloys with melt overheating temperature and cooling rate. Mater. Sci. Eng., A 437, 451 (2006).CrossRefGoogle Scholar
Zu, F.Q., Ding, G.H., and Li, X.F.: Change in solidification behavior of Bi–Sb10 alloy after liquid structural transition. J. Cryst. Growth 310, 397 (2008).CrossRefGoogle Scholar
Zu, F.Q., Chen, J., Li, X.F., Mao, L.N., and Liu, Y.C.: A new viewpoint to the mechanism for the effects of melt overheating on solidification of Pb–Bi alloys. J. Mater. Res. 24, 2378 (2009).CrossRefGoogle Scholar
Qi, X., Ding, G.H., and Zhou, G.W.: Dissolution of solid copper in liquid tin enhanced by the liquid structural transition. J. Appl. Phys. 115, 244907 (2014).CrossRefGoogle Scholar
Wang, L., Bian, X.F., and Liu, J.T.: Discontinuous structural phase transition of liquid metal and alloys (1). Phys. Lett. A 326, 429 (2004).CrossRefGoogle Scholar
Wu, A.Q., Guo, L.J., Liu, C.S., Jia, E.G., and Zhu, Z.G.: Internal friction behavior of liquid Bi–Sn alloys. Physica B 369, 51 (2005).CrossRefGoogle Scholar
Li, X.F., Zu, F.Q., Ding, H.F., Yu, J., Liu, L.J., and Xi, Y.: High-temperature liquid–liquid structure transition in liquid Sn–Bi alloys: Experimental evidence by electrical resistivity method. Phys. Lett. A 354(4), 325 (2006).CrossRefGoogle Scholar
Zhao, J.F., Unuvar, C., Anselmi-Tamburini, U., and Munir, Z.A.: Kinetics of current-enhanced dissolution of nickel in liquid aluminum. Acta Mater. 55, 5592 (2007).CrossRefGoogle Scholar
Yen, Y.W., Chou, W.T., Tseng, Y., Lee, C., and Hsu, C.L.: Investigation of dissolution behavior of metallic substrates and intermetallic compound in molten lead-free solders. J. Electron. Mater. 37(1), 73 (2008).CrossRefGoogle Scholar
Feng, W.F., Wang, C.Q., and Morinaga, M.: Electronic structure mechanism for the wettability of Sn-based solder alloys. J. Electron. Mater. 31(3), 185 (2002).CrossRefGoogle Scholar
Hu, X.W., Li, Y.L., and Min, Z.X.: Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging. J. Alloys Compd. 582, 341 (2014).CrossRefGoogle Scholar
Kang, T.Y., Xiu, Y.Y., Hui, L., Wang, J.J., Tong, W.P., and Liu, C.Z.: Effect of bismuth on intermetallic compound growth in lead free solder/Cu microelectronic interconnect. J. Mater. Sci. Technol. 27(8), 741 (2011).CrossRefGoogle Scholar
Kang, T.Y., Xiu, Y.Y., Liu, C.Z., Hui, L., Wang, J.J., and Tong, W.P.: Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect. J. Alloys Compd. 509, 1785 (2011).CrossRefGoogle Scholar
Baker, H.: ASM Handbook, Vol. 3: Alloy Phase Diagrams (ASM International, Metals Park, 1992).Google Scholar
Takaku, Y., Liu, X.J., Ohnuma, I., Kainuma, R., and Ishida, K.: Interfacial reaction and Morphology between molten Sn base solders and Cu substrate. Mater. Trans. 45(3), 646 (2004).CrossRefGoogle Scholar
Chen, J., Zu, F.Q., Li, X.F., Ding, G.H., Chen, H.S., and Zou, L.: Influence of a liquid structural change on the solidification of the alloy CuSn30. Met. Mater. Int. 14(5), 569 (2008).CrossRefGoogle Scholar
Li, X.F., Zhang, F., Zu, F.Q., Lv, X., Zhao, Z.X., and Yang, D.D.: Effect of liquid–liquid structure transition on solidification and wettability of Sn–0.7Cu solder. J. Alloys Compd. 505, 472 (2010).CrossRefGoogle Scholar
Lupis, C.H.P.: Chemical Thermodynamics of Materials (Elsevier Science Publishing Co. Inc., Amsterdam, 1983); p. 116.Google Scholar
Itami, T., Munejiri, S., Masaki, T., Aoki, H., Ishii, Y., Kamiyama, T., Senda, Y., Shimojo, F., and Hoshino, K.: Structure of liquid Sn over a wide temperature range from neutron scattering experiments and first-principles molecular dynamics simulation: A comparison to liquid Pb. Phys. Rev. B: Condens. Matter Mater. Phys. 67(6), 064201 (2003).CrossRefGoogle Scholar
Liu, C.S., Li, G.X., Liang, Y.F., and Wu, A.Q.: Quantitative analysis based on the pair distribution function for understanding the anomalous liquid-structure change in In20Sn80 . Phys. Rev. B: Condens. Matter Mater. Phys. 71, 064204 (2005).CrossRefGoogle Scholar
Abdelhadi, O.M. and Ladani, L.: IMC growth of Sn–3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms. J. Alloys Compd. 537, 87 (2012).CrossRefGoogle Scholar
Chada, S., Laub, W., Fournelle, R.A., and Shangguan, D.: An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates. J. Electron. Mater. 28(11), 1194 (1999).CrossRefGoogle Scholar
Ma, D., Wang, W.D., and Lahiri, S.K.: Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow. J. Appl. Phys. 91(5), 3312 (2002).CrossRefGoogle Scholar
Prakash, K.H., and Sritharan, T.: Interface reaction between copper and molten tin–lead solders. Acta Mater. 49, 2481 (2001).CrossRefGoogle Scholar
Dybkov, V.I.: Reaction Diffusion and Solid State Chemical Kinetics, 2nd ed. (Trans Tech Publications, Zurich, 2010).Google Scholar