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Effect of electropulsing treatment on solid solution behavior of an aged Mg alloy AZ61 strip

Published online by Cambridge University Press:  31 January 2011

Yanbin Jiang ,
Guoyi Tang ,
Lei Guan ,
Shaonan Wang ,
Zhuohui Xu ,
Chanhung Shek  and
Yaohua Zhu
Yanbin Jiang
Affiliation:
Advanced Materials Institute, Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, People’s Republic of China; and Department of Physics and Materials Science, City University of Hong Kong, Kowloon Tong, Hong Kong
Guoyi Tang*
Affiliation:
Advanced Materials Institute, Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, People’s Republic of China
Lei Guan
Affiliation:
Advanced Materials Institute, Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, People’s Republic of China
Shaonan Wang
Affiliation:
Advanced Materials Institute, Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, People’s Republic of China
Zhuohui Xu
Affiliation:
Advanced Materials Institute, Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, People’s Republic of China
Chanhung Shek
Affiliation:
Department of Physics and Materials Science, City University of Hong Kong, Kowloon Tong, Hong Kong
Yaohua Zhu
Affiliation:
Department of Industrial and Systems Engineering, Hong Kong Polytechnic University, Kowloon, Hong Kong
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

The effect of electropulsing treatment (EPT) on the solution behavior of aged Mg alloy AZ61 strip was investigated using scanning electron microscope (SEM) and x-ray diffraction (XRD). It was found that EPT accelerated tremendously the dissolution of β phase into α matrix in an aged Mg alloy AZ61 strip. The dissolution of β phase took place in less than 4 s at relatively low temperature under EPT, compared with that in conventional heat treatment. A mechanism for rapid solid solution process during EPT was proposed based on the coupling of the thermal and athermal effects. The results in this investigation indicated that EPT played an important role in the nonequilibrium microstructural evolution in the alloy. It is supposed that EPT can provide a highly efficient approach for solid solution treatment of the alloy.

Keywords

ElectromigrationMgPhase transformation
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 10 , October 2008 , pp. 2685 - 2691
Copyright
Copyright © Materials Research Society 2008

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References

REFERENCES

1Misra, A.K.: A novel solidification technique of metals and alloys under the influence of applied potential. Metall. Trans. A 16, 1354 1985CrossRefGoogle Scholar
2Misra, A.K.: Misra technique applied to solidification of cast-iron. Metall. Trans. A 17, 358 1986CrossRefGoogle Scholar
3Nakada, M., Shiohara, Y., Flemings, M.C.: Modification of solidification structures by pulse electric discharging. ISIJ Int. 30, 27 1990CrossRefGoogle Scholar
4Gao, M., He, G.H., Yang, F., Guo, J.D., Yuan, Z.X., Zhou, B.L.: Effect of electric current pulse on tensile strength and elongation of casting ZA27 alloy. Mater. Sci. Eng., A 337, 110 2002CrossRefGoogle Scholar
5Barnak, J.P., Sprecher, A.F., Conrad, H.: Colony (grain) size reduction in eutectic Pb–Sn casting by electropulsing. Scr. Metall. Mater. 32, 879 1995CrossRefGoogle Scholar
6Conrad, H., Karam, N., Mannan, S.: Effect of electric-current pulses on the recrystallization of copper. Scr. Metall. 17, 411 1983CrossRefGoogle Scholar
7Conrad, H., Karam, N., Mannan, S.: Effect of prior cold work on the influence of electric-current pulses on the recrystallization of copper. Scr. Metall. 18, 275 1984CrossRefGoogle Scholar
8Conrad, H., Karam, N., Mannan, S., Sprecher, A.F.: Effect of electric-current pulses on the recrystallization kinetics of copper. Scr. Metall. 22, 235 1988CrossRefGoogle Scholar
9Conrad, H., Guo, Z., Sprecher, A.F.: Effects of electropulse duration and frequency on grain-growth in Cu. Scr. Metall. 24, 359 1990CrossRefGoogle Scholar
10Xu, Z.H., Tang, G.Y., Tian, S.Q., He, J.C.: Research on the engineering application of multiple pulses treatment for recrystallization of fine copper wire. Mater. Sci. Eng., A 424, 300 2006CrossRefGoogle Scholar
11Xu, Z.H., Tang, G.Y., Ding, F., Tian, S.Q., Tian, H.Y.: The effect of multiple pulse treatment on the recrystallization behavior of Mg–3Al–1Zn alloy strip. Appl. Phys. A 88, 429 2007CrossRefGoogle Scholar
12Zhang, W., Sui, M.L., Zhou, Y.Z., Li, D.X.: Evolution of microstructures in materials induced by electropulsing. Micron 34, 189 2003CrossRefGoogle ScholarPubMed
13Zhang, W., Sui, M.L., Hu, K.Y., Li, D.X., Guo, X.N., He, G.H., Zhou, B.L.: Formation of nanophases in a Cu-Zn alloy under high current density electropulsing. J. Mater. Res. 15, 2065 2000CrossRefGoogle Scholar
14Ohno, M., Mirkovic, D., Schmid-Fetzer, R.: Phase equilibria and solidification of Mg-rich Mg–Al–Zn alloys. Mater. Sci. Eng., A 421, 328 2006CrossRefGoogle Scholar
15Duly, D., Audier, M., Brechet, Y.: On the influence of plastic-deformation on discontinuous precipitation in Mg–Al. Scr. Metall. 29, 1593 1993CrossRefGoogle Scholar
16Conrad, H.: Effect of electric current on solid-state phase transformations in metals. Mater. Sci. Eng., A 287, 227 2000CrossRefGoogle Scholar
17Blech, I.A.: Electromigration in thin aluminum films on titanium nitride. J. Appl. Phys. 47, 1203 1976CrossRefGoogle Scholar
18Kinsbron, E.: A model for the width dependence of electromigration lifetimes in aluminum thin-film stripes. Appl. Phys. Lett. 36, 968 1980CrossRefGoogle Scholar
19Xu, Z.H. Applied fundamental research of the high-density pulses on the processing of wrought magnesium alloy thin strip. Ph.D. Thesis, Beijing, Tsinghua University, 2007 61Google Scholar
20Porter, D.A., Easterling, K.E.: Phase Transformations in Metals and Alloys 2nd ed.Chapman & Hall London 1992 68CrossRefGoogle Scholar
21Hummel, R.E.: Electromigration and related failure mechanisms in integrated-circuit interconnects. Int. Mater. Rev. 39, 97 1994CrossRefGoogle Scholar
22Zhou, Y.Z., Zhang, W., Guo, J.D., He, G.H.: Diffusive phase transformation in a Cu–Zn alloy under rapid heating by electropulsing. Philos. Mag. Lett. 84, 341 2004CrossRefGoogle Scholar