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Effect of electric current direction on recrystallization rate and texture of a Cu–Zn alloy

Published online by Cambridge University Press:  16 May 2013

Xinli Wang*
Affiliation:
Research Institute, Northeastern University, Shenyang 110004, People’s Republic of China
Wenbin Dai
Affiliation:
School of Materials and Metallurgy, Northeastern University, Shenyang 110004, People’s Republic of China
Chongwei Ma*
Affiliation:
School of Materials and Metallurgy, Northeastern University, Shenyang 110004, People’s Republic of China
Xiang Zhao*
Affiliation:
School of Materials and Metallurgy, Northeastern University, Shenyang 110004, People’s Republic of China
*
a)Address all correspondence to these authors. e-mail: [email protected]
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Abstract

The relationship between electric current direction and recrystallization rate as well as the resulting texture induced by electric current pulses (ECPs) was investigated in a Cu–Zn alloy. To distinguish the effect of electric current direction on recrystallization rate, the same input energy was exerted upon the samples to eliminate the effect of Joule heating induced by ECPs. Results showed that the recrystallization-related nucleation rate could be greatly enhanced when the electric current was dispositioned at an angle to the rolling direction. The main mechanism for the different nucleation rates might be ascribed to the different driving forces for recrystallization induced by ECPs when there was an angle between the electric current direction and the rolling direction.By all reckoning, it was expected that the ECP treatment would provide a promising approach for controlling the nucleation rate by changing the exerted electric current direction.

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Articles
Copyright
Copyright © Materials Research Society 2013 

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References

REFERENCES

Wierzbanowski, K., Tarasiuk, J., Bacroix, B., and Sztwiertnia, K.: Stored energy and its role in recrystallization process. J. Neutron Res. 9, 61 (2001).CrossRefGoogle Scholar
Peczak, P. and Luton, M.: The effect of nucleation models on dynamic recrystallization I. Homogeneous stored energy distribution. Phil. Mag. B. 68, 115 (1993).CrossRefGoogle Scholar
Larsen, A.W., Poulsen, H.F., Margulies, L., Gundlach, C., Xing, Q.F., Huang, X.X., and Jensen, D.J.: Nucleation of recrystallization observed in situ in the bulk of a deformed metal. Scr. Mater. 53, 553 (2005).CrossRefGoogle Scholar
Humphreys, F. and Matherly, M.: Recrystallization and Related Annealing Phenomena (Elsevier Science Ltd. Publications, New York, 1995), pp. 250, 259.Google Scholar
Doherty, R., Hughes, D., Humphreys, F., Jonas, J., Jensen, D., Kassner, M., King, W., McNelley, T., McQueen, H., and Rollett, A.: Current issues in recrystallization: A review. Mater. Sci. Eng., A 238, 219 (1997).CrossRefGoogle Scholar
Conrad, H., Karam, N., and Mannan, S.: Effect of electric current pulses on the recrystallization of copper. Scr. Metall. 17, 411 (1983).CrossRefGoogle Scholar
Conrad, H., Karam, N., and Mannan, S.: Effect of prior cold work on the influence of electric current pulses on the recrystallization of copper. Scr. Metall. 18, 275 (1984).CrossRefGoogle Scholar
Qin, R.S., Xiao, S.H., Guo, J.D., He, G.H., and Zhou, B.L.: A healing model for metallic materials: Theoretical study. Biomimetics 4, 121 (1996).Google Scholar
Zhou, Y.Z., Xiao, S.H., and Guo, J.D.: Recrystallized microstructure in cold worked brass produced by electropulsing treatment. Mater. Lett. 58, 1948 (2004).CrossRefGoogle Scholar
Xiao, S.H., Guo, J.D., and Li, S.X.: The effect of electropulsing on dislocation structures in [233] coplanar double-slip-oriented fatigued copper single crystals. Philos. Mag. Lett. 82, 617 (2002).CrossRefGoogle Scholar
Hu, G.L., Zhu, Y.H., Shek, C.H., and Tang, G.Y.: Electropulsing induced G-texture evolution in a deformed Fe-3%Si alloy strip. J. Mater. Res. 26, 917 (2011).CrossRefGoogle Scholar
Hu, G.L., Shek, C.H., Zhu, Y.H., and Tang, G.Y.: Electropulsing induced texture evolution in the primary recrystallization of Fe-3%Si alloy strip. Metall. Mater. Trans. A 42, 3484 (2011).CrossRefGoogle Scholar
Dai, W.B., Wang, X.L., Zhao, H.M., and Zhao, X.: Effect of electric current on grain orientation in a cold rolled Fe-3%Si steel. Mater. Trans. 53, 229 (2012).CrossRefGoogle Scholar
Wang, X.L., Guo, J.D., Wang, Y.M., Wu, X.Y., and Wang, B.Q.: Segregation of lead in Cu–Zn alloy under electric current pulses. Appl. Phys. Lett. 89, 61910 (2006).CrossRefGoogle Scholar
Wang, X.L., Wang, Y.B., Wang, Y.M., Wang, B.Q., and Guo, J.D.: Oriented nanotwins induced by electric current pulses in a Cu-Zn alloy. Appl. Phys. Lett. 91, 163112 (2007).CrossRefGoogle Scholar
Conrad, H. and Sprecher, A.F.: Dislocations in Solids, edited by Nabarro, F.R.N. (Elservier, Amsterdam, 1989), p. 499.Google Scholar
Morawiec, A.: On the frequency of occurrence of tilt and twist grain boundaries. Scr. Mater. 61, 438 (2009).CrossRefGoogle Scholar
Hibbard, W.R. Jr. and Dunn, C.G.: A study of <112> edge dislocations in bent silicon-iron single crystals. Acta Metall. 4, 306 (1956).CrossRefGoogle Scholar
Kiselev, S.P.: Dislocation structure of shear bands in single crystals. J. Appl. Mech. Tech. Phys. 47, 857 (2006).CrossRefGoogle Scholar
Okazaki, K., Kagawa, M., and Conrad, H.: A study of the electroplastic effect in metals. Scr. Metall. 12, 1063 (1978).CrossRefGoogle Scholar
Sprecher, A.F., Mannan, S.L., and Conrad, H.: Overview no. 49: On the mechanisms for the electroplastic effect in metals. Acta Metall. 34, 1145 (1986).CrossRefGoogle Scholar
Tang, D.W., Zhou, B.L., Cao, H., and He, G.H.: Thermal stress relaxation behavior in thin films under transient laser-pulse heating. J. Appl. Phys. 73, 3749 (1993).CrossRefGoogle Scholar
Zhou, B.L., He, G.H., Gao, Y.J., Zhao, W.L., and Guo, J.D.: The microscopic nonequilibrium process in solids under transient heating. Inter. J. Therm. 18, 481 (1997).CrossRefGoogle Scholar
Meyers, M. and Chawla, K.: Mechanical Behavior of Materials, 2nd ed. (Cambridge University Press, London, 2009), pp. 109, 249.Google Scholar