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Dynamic recrystallization in high-purity aluminum single crystal under frictionless deformation mode at room temperature

Published online by Cambridge University Press:  11 October 2013

Yong Seok Choi
Affiliation:
Department of Materials Science and Engineering, Seoul National University, Seoul 151-744, Korea
Kyung Il Kim
Affiliation:
Department of Materials Science and Engineering, Seoul National University, Seoul 151-744, Korea
Kyu Hwan Oh
Affiliation:
Department of Materials Science and Engineering, Seoul National University, Seoul 151-744, Korea
Heung Nam Han*
Affiliation:
Department of Materials Science and Engineering and center for Iron and Steel Research, RIAM, Seoul National University, Seoul 151-744, Korea
Suk Hoon Kang
Affiliation:
Nuclear Material Research Division, Korea Atomic Energy Research Institute, Yuseong-gu, Daejeon 305-353, Korea
Jinsung Jang
Affiliation:
Nuclear Material Research Division, Korea Atomic Energy Research Institute, Yuseong-gu, Daejeon 305-353, Korea
Jun Hyun Han*
Affiliation:
Department of Nanomaterials Engineering, Chungnam National University, Daejeon 305-764, Korea
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Dynamic recrystallization (DRX) of 99.9999% aluminum single crystal at room temperature was examined under frictionless deformation mode. To exclude the self-heating of the specimen due to applied high strain, a microcrack that localizes the stress at a very small region was intentionally introduced by controlled local necking. For the in situ observation of DRX, a specially designed in situ microdeformation device was positioned inside an electron backscattered diffraction system chamber. Recrystallized grains showed relatively random texture and preferred growth direction. The subgrains with low-angle grain boundaries formed by dynamic recovery transformed into small grains with high-angle grain boundaries, acting as nuclei for discontinuous dynamic recrystallization and growing by further deformation. The DRX in pure aluminum can take place under frictionless tensile deformation conditions at room temperature, and the stress localization and high purity are key issues for the DRX of aluminum at room temperature.

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Articles
Copyright
Copyright © Materials Research Society 2013 

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References

REFERENCES

Cram, D.G., Zurob, H.S., Brechet, Y.J.M., and Hutchinson, C.R.: Modelling discontinuous dynamic recrystallization using a physically based model for nucleation. Acta Mater. 57, 5218 (2009).CrossRefGoogle Scholar
Sakai, T. and Jonas, J.J.: Overview no. 35 dynamic recrystallization: Mechanical and microstructural considerations. Acta Metall. 32, 189 (1984).CrossRefGoogle Scholar
Luton, M. and Sellars, C.: Dynamic recrystallization in nickel and nickel-iron alloys during high temperature deformation. Acta Metall. 17, 1033 (1969).CrossRefGoogle Scholar
Doherty, R., Hughes, D., Humphreys, F., Jonas, J., Jensen, D.J., Kassner, M., King, W., McNelley, T., McQueen, H., and Rollett, A.: Current issues in recrystallization: A review. Mater. Sci. Eng., A 238, 219 (1997).CrossRefGoogle Scholar
Gourdet, S. and Montheillet, F.: An experimental study of the recrystallization mechanism during hot deformation of aluminium. Mater. Sci. Eng., A 283, 274 (2000).CrossRefGoogle Scholar
Gourdet, S. and Montheillet, F.: A model of continuous dynamic recrystallization. Acta Mater. 51, 2685 (2003).CrossRefGoogle Scholar
Yang, X., Miura, H., and Sakai, T.: Continuous dynamic recrystallization in a superplastic 7075 aluminum alloy. Mater. Trans. 43, 2400 (2002).CrossRefGoogle Scholar
Bernard, P., Bag, S., Huang, K., and Logé, R.E.: A two-site mean field model of discontinuous dynamic recrystallization. Mater. Sci. Eng., A 528, 7357 (2011).CrossRefGoogle Scholar
Montheillet, F. and Le Coze, J.: Influence of purity on the dynamic recrystallization of metals and alloys. Phys. Status Solidi A 189, 51 (2002).3.0.CO;2-M>CrossRefGoogle Scholar
McQueen, H.: Deficiencies in continuous DRX hypothesis as a substitute for DRV theory. Mater. Forum 28, 351 (2004).Google Scholar
McQueen, H.: Development of dynamic recrystallization theory. Mater. Sci. Eng., A 387, 203 (2004).CrossRefGoogle Scholar
Wang, J., Horita, Z., Furukawa, M., Nemoto, M., Tsenev, N.K., Valiev, R.Z., Ma, Y., and Langdon, T.G.: An investigation of ductility and microstructural evolution in an Al−3% Mg alloy with submicron grain size. J. Mater. Res. 8, 2810 (1993).CrossRefGoogle Scholar
Kassner, M. and Barrabes, S.: New developments in geometric dynamic recrystallization. Mater. Sci. Eng., A 410, 152 (2005).CrossRefGoogle Scholar
Chu-ming, L., Jiang, S., and Zhang, X.: Continuous dynamic recrystallization and discontinuous dynamic recrystallization in 99.99% polycrystalline aluminum during hot compression. Trans. Nonferrous Met. Soc. China 15, 82 (2005).Google Scholar
Bai, S., Liu, Z., Zhou, X., Gu, Y., and Yu, D.: Strain-induced dissolution of Cu-Mg co-clusters and dynamic recrystallization near a fatigue crack tip of an underaged Al-Cu-Mg alloy during cyclic loading at ambient temperature. Scr. Mater. 64, 1133 (2011).CrossRefGoogle Scholar
Ferrasse, S., Hartwig, K.T., Goforth, R.E., and Segal, V.M.: Microstructure and properties of copper and aluminum alloy 3003 heavily worked by equal channel angular extrusion. Metall. Mater. Trans. A 28, 1047 (1997).CrossRefGoogle Scholar
Yamagata, H.: Multipeak stress oscillations of five-nine-purity aluminum during a hot compression test. Scr. Metall. Mater. 27, 201 (1992).CrossRefGoogle Scholar
Yamagata, H.: Dynamic recrystallization of single-crystalline aluminum during compression tests. Scr. Metall. Mater. 27, 727 (1992).CrossRefGoogle Scholar
Liss, K.D., Schmoelzer, T., Yan, K., Reid, M., Peel, M., Dippenaar, R., and Clemens, H.: In situ study of dynamic recrystallization and hot deformation behavior of a multiphase titanium aluminide alloy. J. Appl. Phys. 106, 113526 (2009).CrossRefGoogle Scholar
Ferrasse, S., Segal, V.M., Hartwig, K.T., and Goforth, R.E.: Development of a submicrometer-grained microstructure in aluminum 6061 using equal channel angular extrusion. J. Mater. Res. 12, 1253 (1997).CrossRefGoogle Scholar
Kassner, M., Pollard, J., Evangelista, E., and Cerri, E.: Restoration mechanisms in large-strain deformation of high purity aluminum at ambient temperature and the determination of the existence of “steady-state”. Acta Metall. Mater. 42, 3223 (1994).CrossRefGoogle Scholar
Kassner, M.E., McQueen, H.J., Pollard, J., Evangelista, E., and Cerri, E.: Restoration mechanisms in large-strain deformation of high purity aluminum at ambient temperature. Scr. Metall. Mater. 31, 1331 (1994).CrossRefGoogle Scholar
Ponge, D., Bredehöft, M., and Gottstein, G.: Dynamic recrystallization in high purity aluminum. Scr. Mater. 37, 1769 (1997).CrossRefGoogle Scholar
Hokka, M., Kokkonen, J., Seidt, J., Matrka, T., Gilat, A., and Kuokkala, V-T.: High strain rate torsion properties of ultrafine-grained aluminum. Exp. Mech. 52, 195 (2012).CrossRefGoogle Scholar
Li, D.H., Yang, Y., Xua, T., Zheng, H.G., Zhu, Q.S., and Zhang, Q.M.: Observation of the microstructure in the adiabatic shear band of 7075 aluminum alloy. Mater. Sci. Eng., A 527, 3529 (2010).CrossRefGoogle Scholar
Han, J.H., Jee, K.K., and Oh, K.H.: Orientation rotation behavior during in situ tensile deformation of polycrystalline 1050 aluminum alloy. Int. J. Mech. Sci. 45, 1613 (2003).CrossRefGoogle Scholar
Kim, D.H., Kim, S.J., Kim, S.H., Rollett, A.D., Oh, K.H., and Han, H.N.: Microtexture development during equibiaxial tensile deformation in monolithic and dual phase steels. Acta Mater. 59, 5462 (2011).CrossRefGoogle Scholar
Hughes, D., Hansen, N., and Bammann, D.: Geometrically necessary boundaries, incidental dislocation boundaries and geometrically necessary dislocations. Scr. Mater. 48, 147 (2003).CrossRefGoogle Scholar
Kuhlmann-Wilsdorf, D. and Hansen, N.: Geometrically necessary, incidental and subgrain boundaries. Scr. Metall. Mater. 25, 1557 (1991).CrossRefGoogle Scholar
Mariani, E., Mecklenburgh, J., Wheeler, J., Prior, D.J., and Heidelbach, F.: Microstructure evolution and recrystallization during creep of MgO single crystals. Acta Mater. 57, 1886 (2009).CrossRefGoogle Scholar
McQueen, H. and Kassner, M.: Comments on ‘a model of continuous dynamic recrystallization’ proposed for aluminum. Scr. Mater. 51, 461 (2004).CrossRefGoogle Scholar
Yamagata, H.: Dynamic recrystallization and dynamic recovery in pure aluminum at 583K. Acta Metall. Mater. 43, 723 (1995).CrossRefGoogle Scholar
Chovet, C., Gourdet, S., and Montheillet, F.: Modelling the transition from discontinuous to continuous dynamic recrystallization with decreasing purity in aluminium. Mater. Trans., JIM 41, 109 (2000).CrossRefGoogle Scholar
Zhang, K., Weertman, J., and Eastman, J.: Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures. Appl. Phys. Lett. 87, 061921 (2005).CrossRefGoogle Scholar
Yamagata, H., Ohuchida, Y., Saito, N., and Otsuka, M.: Nucleation of new grains during discontinuous dynamic recrystallization of 99.998 mass% aluminum at 453 K. Scr. Mater. 45, 1055 (2001).CrossRefGoogle Scholar