Hostname: page-component-586b7cd67f-g8jcs Total loading time: 0 Render date: 2024-11-26T23:47:01.609Z Has data issue: false hasContentIssue false
  • English
  • Français

Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders

Published online by Cambridge University Press:  31 January 2011

Yu-chih Huang ,
Sinn-wen Chen ,
Wojcieh Gierlotka ,
Chia-hua Chang  and
Jen-chin Wu
Yu-chih Huang
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu, Taiwan
Sinn-wen Chen
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu, Taiwan
Wojcieh Gierlotka
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu, Taiwan; and Non-Ferrous Metals Department, AGH University of Science and Technology, 30-059 Krakow, Poland
Chia-hua Chang
Affiliation:
Chemical Systems Research Division, Chung-Shan Institute of Science and Technology, LungTan, Taiwan
Jen-chin Wu
Affiliation:
Chemical Systems Research Division, Chung-Shan Institute of Science and Technology, LungTan, Taiwan
Get access

Abstract

Solder pots used in wave soldering are usually made using different kinds of steel. Dissolution and interfacial reactions of the Fe substrate in molten Sn-Pb and Sn-Cu solders are investigated in this study. FeSn2 phase is formed in the Sn-0.7wt%Cu/Fe couples reacted at 250, 400, and 500 °C, as well as in the Sn-37wt%Pb/Fe couples reacted at 250 and 400 °C. The activation energies of formation are 123 and 121 kJ/mol in the Sn-Cu/Fe and Sn-Pb/Fe couples, respectively. FeSn phase is the reaction product in the Sn-37wt%Pb/Fe couples reacted 500 °C. The dissolution rates of Fe in the Sn-0.7wt%Cu melt are much higher than those in-the Sn-37wt%Pb melt. The FeSn2 phase layer in the Sn-Cu/Fe couple is not as dense as that in the Sn-Pb/Fe couple and accounts for the very different dissolution rates. Detachment of the reaction FeSn2 phase into the solder matrix is observed in the Sn-Cu/Fe couples, and is a potential contaminant source in wave soldering.

Keywords

SolderingPhase equilibriaSn
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 10 , October 2007 , pp. 2924 - 2929
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Vianco, P.T.Frear, D.R.: Issues in the replacement of lead-bearing solders. JOM 45(7), 14 1993CrossRefGoogle Scholar
2Wassink, R.J. Klein: Soldering in Electronics 2 ed.Electrochemical Publicatio Isle of Man, British Isles, Engla 1989Google Scholar
3Parliament 3 Directive 2002/95/EC of the European 2003 of the Council of 27 January On the restriction of the use of certain hazardous substances in electronic equipment.Official J. Eur. Union, L 37/19 (2003)Google Scholar
4Glazer, J.: Metallurgy of low-temperature Pb-free solders for electronic assembly. Int. Mater. Rev. 40(2), 65 1995CrossRefGoogle Scholar
5Chen, S.W., Chen, C.M.Liu, W.C.: Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions. J. Electron. Mater. 27(11), 1193 1998CrossRefGoogle Scholar
6Abtew, M.Selvaduary, G.: Lead-free solders in microelectronics. Mater. Sci. Eng., R-Rep. 27(5–6), 95 2000CrossRefGoogle Scholar
7Zeng, K.Tu, K.N.: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng., R-Rep. 38(2), 55 2002CrossRefGoogle Scholar
8Chang, H.Y., Chen, S.W., Wong, D.S.H.Hsu, H.F.: Determination of reactive wetting properties of Sn, Sn-Cu, Sn-Ag and Sn-Pb alloys by using a wetting balance technique. J. Mater. Res. 18(6), 1420 2003CrossRefGoogle Scholar
9Conrad, H.: Effects of electric current on solid-state phase transformations in metals. Mater. Sci. Eng., A-Struct. Mater. Prop. Microstruct. Process. 287, 227 2000CrossRefGoogle Scholar
10Suganuma, K.: Advances in lead-free electronics soldering. Curr. Opin. Solid State Mater. Sci. 5, 55 2001CrossRefGoogle Scholar
11Chen, S.W., Wang, C.H., Lin, S.K.Chiu, C.N.: Phase Diagrams of Pb-Free Solders and their Related Materials Systems. J. Mater. Sci. Mater. Electron. 18, 19 2007CrossRefGoogle Scholar
12Chen, S.W., Wang, C.H., Lin, S.K., Chiu, C.N.Chen, C.C.: Phase transformation and microstructural evolution in solder joints. JOM 59(1), 39 2007CrossRefGoogle Scholar
13Ishida, K.: The reaction of solid iron with molten tin. Mater. Tans., JIM 14, 37 1973Google Scholar
14Perger, G.R.Robinson, P.M.: The performance of electrodeposited iron plate in contact with lead-tin alloys. Electrodeposition and Surface Treatment. 2(1), 75 1974CrossRefGoogle Scholar
15Habenicht, G.Schindele, P.: Iron Contamination in Solder Baths. Schweissen Schneiden 35(11), 530 1983Google Scholar
16Takemoto, T., Uetani, T.Yamazaki, M.: Dissolution rates of iron plating on soldering iron tips in molten lead-free solders. Solder. Surf. Mt. Technol. 16(3), 9 2004CrossRefGoogle Scholar
17Sueyoshi, H., Odo, H., Mizokuchi, S., Abe, S.Saikusa, K.: Consumption of soldering iron by Pb-free solder. Mater. Trans. 47(4), 1221 2006CrossRefGoogle Scholar
18Okamoto, H.: Fe-Sn (iron-tin) in Binary Alloy Phase Diagrameditedby H. Okamoto, P.R. Subramanian, and L. Kacprzak, 2nd ed.ASM International Materials Park, OH 1990Google Scholar
19van Beek, J.A., Stolk, S.A.van Loo, F.J.J.: Multiphase diffusion in the systems Fe-Sn and Si-Sn. Z. Metallkd. 73(7), 439 1982Google Scholar
20Chou, C.Y., Chen, S.W.Chang, Y.S.: Interfacial reactions in the Sn–9Zn–(xCu)/Cu and Sn–9Zn–(xCu)/Ni couples. J. Mater. Res. 21(7), 1849 2006CrossRefGoogle Scholar
21Huang, C.Y.Chen, S.W.: Interfacial reactions in In-Sn/Ni couples and phase equailibria of the In-Sn-Ni system. J. Electron. Mater. 31(2), 152 2002CrossRefGoogle Scholar
22Hayashi, A., Kao, C.R.Chang, Y.A.: Reactions of solid copper with pure liquid tin and liquid tin saturated with copper. Scripta Mater. 37(4), 393 1997CrossRefGoogle Scholar
23Suganuma, K., Niihara, K., Shoutoku, T.Nakamura, Y.: Wetting and interface microstructure between Sn-Zn binary alloys and Cu. J. Mater. Res. 13(10), 2859 1998CrossRefGoogle Scholar
24Hsu, H.F.Chen, S.W.: Phase equilibria of the Sn-Ag-Ni ternary system and interfacial reactions at the Sn-Ag/Ni joints. Acta Mater. 52(9), 2541 2004CrossRefGoogle Scholar
25Kumar, K.C. Hari, Wollants, P.Delaey, L.: Thermodynamic evaluation of Fe-Sn phase diagram. Calphad 20(2), 139 1996CrossRefGoogle Scholar
26Ohtani, H., Okuda, K.Ishida, K.: Thermodynamic study of phase equilibria in the Pb-Sn-Sb system. J. Phase Equilib. 16(5), 416 1995CrossRefGoogle Scholar
27Onderka, B., Pomianek, T., Romanowska, J., Wnuk, G.Wypartowicz, J.: Solubility of lead in liquid iron and the assessment of Fe-Pb system. Arch. Metall. Mater. 49(1), 144 2004Google Scholar
28Muggianu, Y.M., Gambino, M.Bros, J.P.: Enthalpies of formation of liquid Bi-Ga-Sn tin alloys at 723 K-the analytical representation of the total and partial excess functions of mixing. J. Chim. Phys. 72(1), 83 1975CrossRefGoogle Scholar
29Eremenko, V.N., Pechentkovskaya, L.E.Churakov, M.M.: Formation of an intermediate layer of the phase FeSn2 during hot leading. Fiz. Khim. Obrab. Mater. 3, 124 1976Google Scholar