Hostname: page-component-586b7cd67f-2plfb Total loading time: 0 Render date: 2024-11-26T11:42:59.320Z Has data issue: false hasContentIssue false

Development of a Seebeck coefficient Standard Reference Material™

Published online by Cambridge University Press:  21 July 2011

Nathan D. Lowhorn
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Winnie Wong-Ng*
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Zhan-Qian Lu
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Joshua Martin
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Martin L. Green
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
John E. Bonevich
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Evan L. Thomas
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Neil R. Dilley
Affiliation:
Quantum Design, Inc., San Diego, California 92126
Jeff Sharp
Affiliation:
Marlow Industries, Inc., Dallas, Texas 75238
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

We have successfully developed a Seebeck coefficient Standard Reference Material (SRM™), Bi2Te3, that is essential for interlaboratory data comparison and for instrument calibration. Certification measurements were performed using a differential steady-state technique on 10 samples (15 measurements) randomly selected from a batch of 390 bars. The certified Seebeck coefficient values are provided from 10 to 390 K, and they are further supported by transient measurements. The availability of this SRM will validate measurement results, leading to a better understanding of the structure/property relationships and underlying physics of potential high-efficiency thermoelectric materials.

Type
Articles
Copyright
Copyright © Materials Research Society 2011

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Tritt, T.M. and Subramanian, M.A.: Thermoelectric materials, phenomena, and applications: A bird?s eye view. MRS Bull. 31(3), 188–198 (2006).CrossRefGoogle Scholar
2.Tritt, T.M.: Thermoelectrics run hot and cold. Science 272, 1276 (1996).CrossRefGoogle Scholar
3.Hsu, K.F., Loo, S., Guo, F., Chen, W., Dyck, J.S., Uher, C., Hogan, T., Polychroniadis, E.K., and Kanatzidis, M.G.: Cubic AgPbmSbTe2+m: Bulk thermoelectric materials with high figure of merit. Science 303, 818 (2004).CrossRefGoogle ScholarPubMed
4.Venkatasubramanian, R., Siivola, E., Colpitts, T., and O’Quinn, B.: Thin-film thermoelectric devices with high room-temperature figures of merit. Nature 413, 597 (2001).CrossRefGoogle ScholarPubMed
5.Ghamaty, S. and Elsner, N.B.: Quantum Well Thermoelectric Devices, in Proceeding of Interpack 2005: ASME Technical Conference on Packaging of MEMS, NEWS and Electric Systems, July 17–22, San Francisco, CA.Google Scholar
6.Rao, A., Ji, X., and Tritt, T.M.: Properties of nanostructural one-dimensional and composite thermoelectric materials. MRS Bull. 31(3), 218 (2006).CrossRefGoogle Scholar
7.ISO Guide 35: 2006-Reference materials—General and statistical principles for certification.Google Scholar
8.Lowhorn, N.D., Wong-Ng, W., Lu, Z.Q. J., Zhang, W., Thomas, E., Otani, M., Green, M., Tran, T.N., Caylor, C., Dilley, N.R., Downey, A., Edwards, B., Elsner, N., Ghamaty, S., Hogan, T., Jie, Q., Li, Q., Martin, J., Nolas, G., Obara, H., Sharp, J., Venkatasubramanian, R., Willigan, R., Yang, J., and Tritt, T.: Round-robin measurements of two candidate materials for a Seebeck coefficient Standard Reference MaterialTM. Appl. Phys. Mater. Sci. Process 94, 231–234 (2009).CrossRefGoogle Scholar
9.Lu, Z.Q.J., Lowhorn, N.D., Wong-Ng, W., Zhang, W., Thomas, E., Otani, M., Green, M., Tran, T.N., Caylor, C., Dilley, N.R., Downey, A., Edwards, B., Elsner, N., Ghamaty, S., Hogan, T., Jie, Q., Li, Q., Martin, J., Nolas, G., Obara, H., Sharp, J., Venkatasubramanian, R., Willigan, R., Yang, J., and Tritt, T.: Statistical analysis of a round-robin measurement survey of two candidate materials for a Seebeck coefficient Standard Reference Material. J. Res. Nat. Inst. Stand. Technol. 114(1), 37 (2009).CrossRefGoogle Scholar
10.Scherrer, H. and Scherrer, S.: Thermoelectric Properties of Bismuth Antimony Telluride Solid Solutions. Thermoelectrics Handbook: Macro to Nano, edited by Rowe, D.M. (CRC, Published by Taylor & Francis Group, Boca Raton, FL, 2005), pp. 27–6.Google Scholar
11.Sankara Narayanan, T.S.N., Baskaran, I., Krishnaveni, K., and Parthiban, S.: Deposition of electroless Ni–P graded coatings and evaluation of their corrosion resistance. Surf. Coat. Tech. 200, 3438 (2006).CrossRefGoogle Scholar
12.Das, C.M., Limaye, P.K., Grover, A.K., and Suri, A.K.: Preparation and characterization of silicon nitride codeposited electroless nickel composite coatings. J. Alloy. Comp. 436, 328 (2007).CrossRefGoogle Scholar
13.Tritt, T.M.: Thermoelectric Handbook: Macro to Nano, edited by Rowe, D.M. (CRC, Taylor & Francis Group, Boca Raton, FL, 2005), pp. 23–5.Google Scholar
14.Physical Property Measurement System (PPMS): Hardware and Options. Electrical and Thermal Transport Measurement Techniques for Evaluation of the Figure-of-Merit of Bulk Materials 23-1 through 21–17. Quantum Design, San Diego, CA.Google Scholar
15.Taylor, B.N. and Kuyatt, C.E.: Guidelines for evaluating and expressing uncertainty of NIST measurement results. NIST Technical Note 1297 (1994). Available at http://www.nist.gov/pml/pubs/tn1297/index.cfm.Google Scholar
16.Burns, G.W. and Scroger, M.G.: NIST Measurement Services: The Calibration of Thermocouples and Thermoelectric Materials. NIST Special Publication 250-35 (1989). Available at http://ts.nist.gov/MeasurementServices/Calibrations/upload/SP250-35.pdf.CrossRefGoogle Scholar
17.Fuller, W.A.: Measurement Error Models (Wiley, New York, 1987).CrossRefGoogle Scholar
18.Berkson, J.: Are there two regressions? J. Am. Stat. Assoc. 45(250), 164 (1950).CrossRefGoogle Scholar
19.Kittel, C.: Solid State Physics, 2nd ed. (Wiley, New York, 1956), p. 296.Google Scholar