Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Muppidi, T.
Kusama, Y.
and
Field, D.P.
2002.
Effect of Texture on Hillock Formation in Aluminum Films.
MRS Proceedings,
Vol. 721,
Issue. ,
Dehm, Gerhard
Balk, T.John
Edongué, Hervais
and
Arzt, Eduard
2003.
Small-scale plasticity in thin Cu and Al films.
Microelectronic Engineering,
Vol. 70,
Issue. 2-4,
p.
412.
Knight, J.
McLean, J.
and
Degertekin, F.L.
2004.
Low temperature fabrication of immersion capacitive micromachined ultrasonic transducers on silicon and dielectric substrates.
IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control,
Vol. 51,
Issue. 10,
p.
1324.
Xiao, Ke
Guan, Zi Sheng
Wang, Guo Jie
Jiang, Lei
Zhu, Dao Ben
and
Wang, Yu Ren
2004.
Laser-induced wavy pattern formation in metal thin films.
Applied Physics Letters,
Vol. 85,
Issue. 11,
p.
1934.
Gall, Ken
West, Neil
Spark, Kevin
Dunn, Martin L.
and
Finch, Dudley S.
2004.
Creep of thin film Au on bimaterial Au/Si microcantilevers.
Acta Materialia,
Vol. 52,
Issue. 8,
p.
2133.
Sauter, Linda
Balk, T. John
Dehm, Gerhard
Nucci, Julie A.
and
Arzt, Eduard
2005.
Hillock formation and thermal stresses in thin Au films on Si substrates.
MRS Proceedings,
Vol. 875,
Issue. ,
Boettinger, W.J.
Johnson, C.E.
Bendersky, L.A.
Moon, K.-W.
Williams, M.E.
and
Stafford, G.R.
2005.
Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits.
Acta Materialia,
Vol. 53,
Issue. 19,
p.
5033.
Lee, Seongkuk
Yang, Dongfang
and
Nikumb, Suwas
2007.
Femtosecond laser patterning of Ta0.1W0.9Ox/ITO thin film stack.
Applied Surface Science,
Vol. 253,
Issue. 10,
p.
4740.
Berla, Lucas A.
Joo, Young-Chang
and
Nix, William D.
2008.
A model for power law creep controlled hillock growth.
Materials Science and Engineering: A,
Vol. 488,
Issue. 1-2,
p.
594.
Park, T.-S.
Dao, M.
Suresh, S.
Rosakis, A.J.
Pantuso, D.
and
Shankar, S.
2008.
Some Practical Issues of Curvature and Thermal Stress in Realistic Multilevel Metal Interconnect Structures.
Journal of Electronic Materials,
Vol. 37,
Issue. 6,
p.
777.
Chen, Yu-jen
and
Chen, Chih-ming
2009.
Mitigative Tin Whisker Growth Under Mechanically Applied Tensile Stress.
Journal of Electronic Materials,
Vol. 38,
Issue. 3,
p.
415.
Qu, Y.Q.
Melamud, R.
and
Kenny, T.W.
2009.
Using encapsulated MEMS resonators to measure evolution in thin film stress.
p.
1138.
Qu, Yu Qiao
Melamud, Renata
Chandorkar, Saurabh
Lee, Hyung Kyu
and
Kenny, Thomas.W.
2010.
Stress relaxation study of sputtered Platinum thin films at near room temperature using an ultrasensitive strain gauge.
p.
548.
Vodnick, Aaron M.
Nowak, David E.
Labat, Stephane
Thomas, Olivier
and
Baker, Shefford P.
2010.
Out-of-plane stresses arising from grain interactions in textured thin films.
Acta Materialia,
Vol. 58,
Issue. 7,
p.
2452.
Kim, Deok-kee
2012.
Effect of SiO2 passivation overlayers on hillock formation in Al thin films.
Thin Solid Films,
Vol. 520,
Issue. 21,
p.
6571.
Galinski, Henning
Ryll, Thomas
Schlagenhauf, Lukas
Gauckler, Ludwig J.
Stender, Patrick
and
Schmitz, Guido
2012.
Hillock formation of Pt thin films on single-crystal yttria-stabilized zirconia.
Physical Review B,
Vol. 85,
Issue. 12,
Kim, Suk Jun
Stach, Eric A.
and
Handwerker, Carol A.
2012.
Silver layer instability in a SnO2/Ag/SnO2 trilayer on silicon.
Thin Solid Films,
Vol. 520,
Issue. 19,
p.
6189.
Nojiri, Hidetoshi
and
Okoshi, Masayuki
2016.
Crack suppression of silica glass formed by zoned F2 laser-induced photochemical surface modification of hard silicone thin film coating on polycarbonate.
Japanese Journal of Applied Physics,
Vol. 55,
Issue. 12,
p.
122701.
Raić, K. T.
2016.
An explanation of hillock growth in thin Al films.
Surface Engineering,
Vol. 32,
Issue. 11,
p.
823.
Sun, Haoliang
Huang, Xiaoxue
Lian, Xinxin
and
Wang, Guangxin
2019.
Discrepancies in the Microstructures of Annealed Cu–Zr Bulk Alloy and Cu–Zr Alloy Films.
Materials,
Vol. 12,
Issue. 15,
p.
2467.