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Creep behavior of eutectic Sn–Ag lead-free solder alloy

Published online by Cambridge University Press:  26 July 2012

M. L. Huang ,
L. Wang  and
C. M. L. Wu
M. L. Huang
Affiliation:
Department of Materials Engineering, Dalian University of Technology, Dalian 116024, People's Republic of China
L. Wang
Affiliation:
Department of Materials Engineering, Dalian University of Technology, Dalian 116024, People's Republic of China
C. M. L. Wu*
Affiliation:
Department of Physics and Materials Science, City University of Hong Kong, 83 Tat Chee Avenue, Hong Kong SAR, People's Republic of China
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

Precipitation-strengthened tin-based eutectic Sn–3.5 Ag alloy was investigated for its creep behavior at three temperatures ranging from 303 to 393 K, under the tensile stress range of σ/E = 10−4 to 10−3. The steady-state creep rates cover seven orders of magnitude (10−3 to 10−9 s−1). The initial microstructure was found to have Ag3Sn intermetallic compound finely dispersed in the matrix of β–Sn. By incorporation of a threshold stress, σth, into the analysis, the creep data of eutectic Sn–Ag at all temperatures can be fitted by a single straight line with a slope of seven after normalizing the steady-state creep rate and the effective stress, indicating that the creep rates are controlled by the dislocation-pipe diffusion in the Sn matrix. The steady-state creep rate, , can then be expressed as , where QC is the creep activation energy, G is the temperature-dependent shear modulus, b is Burger's vector, R is the universal gas constant, T is the absolute temperature, σ is the applied stress, A is a material-dependent constant, and , in which σOB is the Orowan bowing stress and kR is the relaxation factor.

Type
Articles
Information
Journal of Materials Research , Volume 17 , Issue 11 , November 2002 , pp. 2897 - 2903
Copyright
Copyright © Materials Research Society 2002

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