Hostname: page-component-745bb68f8f-s22k5 Total loading time: 0 Render date: 2025-01-09T20:57:28.350Z Has data issue: false hasContentIssue false
  • English
  • Français

Cracks and dislocations in face-centered cubic metallic multilayers

Published online by Cambridge University Press:  31 January 2011

David S. Lashmore  and
Robb Thomson
David S. Lashmore
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Robb Thomson
Affiliation:
National Institute of Standards and Technology, Gaithersburg, Maryland 20899
Get access

Abstract

In this paper, we have demonstrated that very perfect thin multilayers of the Cu/Ni system can be prepared with coherent interfaces if the layer modulation wavelength is in the 10 nm range. At modulation thicknesses above about 60 nm, the interfaces become incoherent. We have injected a crack into a coherent interface in the 10 nm case which has generated dislocations into the interface forming the crack plane, as well as into the layers adjacent to the crack plane. The dislocations injected into the crack plane presumably form misfit dislocations on that interface, and are grouped so close to the crack tip that individual dislocations are not completely imaged. The dislocations injected into the adjacent layers are distributed rather widely. We have analyzed the dislocation emission from a crack in the fcc geometry appropriate to the multilayers using a simplified elastic theory developed for cracks in homogeneous materials. The mixed mode loading which the misfit stresses are expected to produce lead one to expect these materials to be ductile and to have high toughness. Very high dislocation densities on the crack plane near the crack, however, may lead to a brittle mode of failure, which is beyond the purview of the elastic theory. The dislocations are observed to have strong interactions with alternating interfaces in the multilayers, and this effect could be due to elastic bunching of the dislocations at alternating interfaces caused by the misfit stress.

Type
Articles
Information
Journal of Materials Research , Volume 7 , Issue 9 , September 1992 , pp. 2379 - 2386
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Blum, W., 40th Gen. Meeting of the Am. Electrochem. Soc. Oct. 1, 1921.Google Scholar
2.Tsakalakos, T. and Hilliard, J. E., J. Appl. Phys. 54, 734 (1983); D. Baral, J. B. Ketterson, and J. E. Hilliard, J. Appl. Phys. 57, 107 (1985); W. M. C. Yang, T. Tsakalakos, and J. E. Hilliard, J. Appl. Phys. 48, 876 (1977); G. Henein and J. E. Hilliard, J. Appl. Phys. 54, 728 (1983).CrossRefGoogle Scholar
3.Cammarata, R., Scripta Metall. 20, 479–480 (1986).CrossRefGoogle Scholar
4.Wu, T. B., J. Appl. Phys. 5265 (1982); W. E. Pickett, J. Phys. 2195 (1982); A. F. Jankowski, J. Phys. F 18, 413 (1988).Google Scholar
5.Davis, B. M., Seidman, D. N., Moreau, A., Ketterson, J. B., Matson, J., and Grimsditch, M., Phys. Rev. B 43 (11), 15 (April 1991).Google Scholar
6.Tench, D. and White, J., Metall. Trans. A 15A, 2039 (1984).CrossRefGoogle Scholar
7.Ruff, W. A. and Wang, Z., Wear 131, 259 (1989).CrossRefGoogle Scholar
8. (a) Brenner, A., in Electrodeposition of Alloys, Principles and Practice (Academic Press, New York, 1963); U. Cohen, F. B. Koch, and R. Sard, J. Electrochem. Soc. 130,10 (1987); D. Tench and J. White, Metall. Trans. 15A, 2039 (1984); C. Ogden, Plating and Surface Finishing 73, 130 (1986); D. S. Lashmore and M. P. Dariel, J. Electrochem. Soc. 135, 5, 1218 (1988); J. Yahalom and O. Zadok, J. Mater. Soc. 22, 6, 499 (1989); A.R. Despić and V. D. Jovic, J. Electrochem. Soc. 134, 3004 (1987); A. R. Despić, V.D. Jovic, and S. Spaic, J. Electrochem. Soc. 136, 1651 (1989). (b) L. H. Bennett, L. J. Swartzendruber, D. S. Lashmore, R. R. Oberle, U. Atzmony, M. P. Dariel, and R. E. Watson, Phys. Rev. B 40, 4633 (1989).Google Scholar
9.Lashmore, D. S. and Dariel, M. P., J. Electrochem. Soc. 135, 5, 1218 (1988).CrossRefGoogle Scholar
10.Xiao, G. and Chen, C. L., J. Appl. Phys. 61, 4061 (1987).CrossRefGoogle Scholar
11.Oberle, R., M. S. Thesis, Johns Hopkins University (unpublished as yet).Google Scholar
12.Lashmore, D. S. and Oberle, R. (in preparation).Google Scholar
13.Lin, I-H. and Thomson, R., Acta Metall. 34, 187 (1986).CrossRefGoogle Scholar
14.England, A. H., Trans. ASME 87, 400 (1965).CrossRefGoogle Scholar
15.Chang, S. and Ohr, S. M., J. Appl. Phys. 52, 7174 (1981).CrossRefGoogle Scholar
16.Weertman, H., Lin, I-H., and Thomson, R., Acta Metall. 31, 473 (1983).CrossRefGoogle Scholar