Hostname: page-component-586b7cd67f-l7hp2 Total loading time: 0 Render date: 2024-11-29T17:18:46.627Z Has data issue: false hasContentIssue false
  • English
  • Français

The cracking and decohesion of thin films

Published online by Cambridge University Press:  31 January 2011

A. G. Evans ,
M. D. Drory  and
M. S. Hu
A. G. Evans
Affiliation:
Materials Department, College of Engineering, University of California, Santa Barbara, California 93106
M. D. Drory
Affiliation:
Materials Department, College of Engineering, University of California, Santa Barbara, California 93106
M. S. Hu
Affiliation:
Materials Department, College of Engineering, University of California, Santa Barbara, California 93106
Get access

Abstract

The cracking and decohesion of thin films can be characterized by critical values of a nondimensional parameter governed by the residual stress, the film thickness, and a fracture resistance. This article reviews the status of understanding concerning the magnitude of this number for various types of adherent film on either brittle or ductile substrates. Important effects of elastic properties, substrate thickness, and yield strength are described.

Type
Commentaries and Reviews
Information
Journal of Materials Research , Volume 3 , Issue 5 , October 1988 , pp. 1043 - 1049
Copyright
Copyright © Materials Research Society 1988

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Hoffman, R. W., Phys. Thin Films 3, 211 (1966).Google Scholar
2Janda, M., Thin Films 142, 37 (1986).CrossRefGoogle Scholar
3Evans, A. G. and Hutchinson, J. W., Intl. J. Solids Struct. 20, 451 (1981).Google Scholar
4Cannon, R. M., Fisher, R. M., and Evans, A. G., Mater. Res. Soc. Proc. 54, 799 (1986).CrossRefGoogle Scholar
5Thouless, M. D., Evans, A. G., Ashby, M. F., and Hutchinson, J. W., Acta Metall. 35, 1333 (1987).CrossRefGoogle Scholar
6Hu, M., Thouless, M. D., and Evans, A. G., Acta Metall. 36, 1301 (1988).CrossRefGoogle Scholar
7Drory, M. D., Thouless, M. D., and Evans, A. G., Acta Metall. (in press).Google Scholar
8Suo, Z. and Hutchinson, J. W., Harvard Applied Sciences Report, MECH 118 (1988).Google Scholar
9Ho, P. (private communication).Google Scholar
10Hu, M. S. and Evans, A. G., Acta Metall. (to be published).Google Scholar
11Rossington, C., Marshall, D. B., Khuri-Yakub, B. T., and Evans, A. G., J. Appl. Phys. 56, 2639 (1984).CrossRefGoogle Scholar
12Charalambides, P. G., Lund, J., McMeeking, R. M., and Evans, A. G., J. Appl. Mech. (in press).Google Scholar
13Loh, R. L., Rossington, C., and Evans, A. G., J. Am. Ceram. Soc. 69 139 (1986).CrossRefGoogle Scholar