Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Wang, T.
Lei, G.
Chen, X.
Guido, L.
Ngo, Khai
and
Lu, G-Q.
2009.
Improved thermal performance of high-power LED by using low-temperature sintered chip attachment.
p.
581.
Lei, Thomas Guangyin
Calata, Jesus Noel
Lu, Guo-Quan
Chen, Xu
and
Luo, Shufang
2010.
Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips.
IEEE Transactions on Components and Packaging Technologies,
Vol. 33,
Issue. 1,
p.
98.
Zhang, Rongwei
Agar, Josh C.
and
Wong, C. P.
2010.
Recent advances on Electrically Conductive Adhesives.
p.
696.
Zhang, Rongwei
Moon, Kyoung-sik
Lin, Wei
and
Wong, C. P.
2010.
Preparation of highly conductive polymer nanocomposites by low temperature sintering of silver nanoparticles.
Journal of Materials Chemistry,
Vol. 20,
Issue. 10,
p.
2018.
Zhang, Rongwei
Lin, Wei
Moon, Kyoung-sik
and
Wong, C. P.
2010.
Fast Preparation of Printable Highly Conductive Polymer Nanocomposites by Thermal Decomposition of Silver Carboxylate and Sintering of Silver Nanoparticles.
ACS Applied Materials & Interfaces,
Vol. 2,
Issue. 9,
p.
2637.
Li, Xin
Chen, Xu
and
Lu, Guo-Quan
2010.
Effect of die-attach material on performance and reliability of high-power light-emitting diode modules.
p.
1344.
Hummelgård, Magnus
Zhang, Renyun
Nilsson, Hans-Erik
Olin, Håkan
and
Docoslis, Aristides
2011.
Electrical Sintering of Silver Nanoparticle Ink Studied by In-Situ TEM Probing.
PLoS ONE,
Vol. 6,
Issue. 2,
p.
e17209.
Zhang, Rongwei
Agar, Josh C.
and
Wong, C. P.
2011.
Encyclopedia of Polymer Science and Technology.
Mei, Yunhui
Lu, Guo-Quan
Chen, Xu
Luo, Shufang
and
Ibitayo, Dimeji
2011.
Migration of Sintered Nanosilver Die-Attach Material on Alumina Substrate Between 250 $^{\circ}\hbox{C}$ and 400 $^{ \circ}\hbox{C}$ in Dry Air.
IEEE Transactions on Device and Materials Reliability,
Vol. 11,
Issue. 2,
p.
316.
Cao, Yunjiao
Chen, Gang
Mei, Yunhui
Li, Xin
Lu, Guo-Quan
and
Chen, Xu
2012.
Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nano-silver Paste.
p.
310.
Siow, Kim S.
2012.
Mechanical properties of nano-silver joints as die attach materials.
Journal of Alloys and Compounds,
Vol. 514,
Issue. ,
p.
6.
Mei, Yunhui
Chen, Gang
Guo-Quan, Lu
and
Chen, Xu
2012.
Effect of joint sizes of low-temperature sintered nano-silver on thermal residual curvature of sandwiched assembly.
International Journal of Adhesion and Adhesives,
Vol. 35,
Issue. ,
p.
88.
Hu, A.
Peng, P.
Alarifi, H.
Zhang, X. Y.
Guo, J. Y.
Zhou, Y.
and
Duley, W. W.
2012.
Femtosecond laser welded nanostructures and plasmonic devices.
Journal of Laser Applications,
Vol. 24,
Issue. 4,
Gang Chen
Yunjiao Cao
Yunhui Mei
Dan Han
Guo-Quan Lu
and
Xu Chen
2012.
Pressure-Assisted Low-Temperature Sintering of Nanosilver Paste for 5$\,\times\,$5-${\rm mm}^{2}$ Chip Attachment.
IEEE Transactions on Components, Packaging and Manufacturing Technology,
Vol. 2,
Issue. 11,
p.
1759.
Lian, Jiaoyuan
Mei, Yunhui
Chen, Xu
Li, Xin
Chen, Gang
and
Zhou, Keqin
2012.
Low-temperature sintering of nanoscale silver paste for double-sided attaching 9×9 mm<sup>2</sup> chip.
p.
232.
Manikam, Vemal Raja
Razak, Khairunisak Abdul
and
Cheong, Kuan Yew
2012.
Sintering of Silver–Aluminum Nanopaste With Varying Aluminum Weight Percent for Use as a High-Temperature Die-Attach Material.
IEEE Transactions on Components, Packaging and Manufacturing Technology,
Vol. 2,
Issue. 12,
p.
1940.
Gao, Hong
Liu, Lan
Liu, Konghua
Luo, Yuanfang
Jia, Demin
and
Lu, Jiasheng
2012.
Preparation of highly conductive adhesives by in situ generated and sintered silver nanoparticles during curing process.
Journal of Materials Science: Materials in Electronics,
Vol. 23,
Issue. 1,
p.
22.
Mei, Yunhui
Chen, Gang
Li, Xin
Lu, Guo‐Quan
and
Chen, Xu
2013.
Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver paste.
Soldering & Surface Mount Technology,
Vol. 25,
Issue. 2,
p.
107.
Manikam, Vemal Raja
Razak, Khairunisak Abdul
and
Cheong, Kuan Yew
2013.
Physical and electrical attributes of sintered Ag80–Al20 high temperature die attach material with different organic additives content.
Journal of Materials Science: Materials in Electronics,
Vol. 24,
Issue. 2,
p.
720.
Hong, Jung-Il
Ding, Yong
Moon, Kyoung-Sik
and
Wong, C. P.
2013.
Enhanced Diffusion of Silver Atoms on the Surface of Nanoparticles at Low Temperatures.
Journal of Electronic Packaging,
Vol. 135,
Issue. 1,