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Continuous electrical in situ contact area measurement during instrumented indentation

Published online by Cambridge University Press:  31 January 2011

Lei Fang ,
Christopher L. Muhlstein ,
James G. Collins ,
Amber L. Romasco  and
Lawrence H. Friedman
Lei Fang
Affiliation:
Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, Pennsylvania 16802
Christopher L. Muhlstein*
Affiliation:
Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802
James G. Collins
Affiliation:
Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802
Amber L. Romasco
Affiliation:
Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802
Lawrence H. Friedman
Affiliation:
Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, Pennsylvania 16802
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

The primary tool for mechanical characterization of surfaces and films is instrumented indentation using the Oliver-Pharr data analysis method. However, this method measures contact area between the indenter and sample indirectly, thus confounding instrumented indentation tests when characterizing dynamic properties, thin films, and materials that “pileup” around the indenter. Here, we demonstrate an electrical technique to continuously measure the in situ contact area by relating nonlinear electrical contact current–voltage (I–V) curves to the instantaneous contact area. Using this approach, we can obtain hardness as a continuous function of applied force.

Keywords

CuElectrical propertiesHardness
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 9 , September 2008 , pp. 2480 - 2485
Copyright
Copyright © Materials Research Society 2008

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References

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